Papers by Author: Xun Li

Abstract: The growth of 4H-SiC epilayers on 1.28^o off-cut substrates is reported in this study and comparison when using standard 4^o and 8^o off-cut substrates is added. Growth at high temperature is needed for the polytype stability, whereas low C/Si is requested to decrease both triangular defects density and roughness of the grown surface. An in-situ etching with Si rich ambient allows the growth of epilayers with specular surface. The formation of Si droplets can be observed on the grown surfaces when lowering the growth temperature and appears first for the high off-cut angle.

Abstract: The growth of 3C-SiC on hexagonal polytype is addressed and a brief review is given for various growth techniques. The Chemical Vapor Deposition is shown as a suitable technique to grow single domain 3C epilayers on 4H-SiC substrate and a 12.5 µm thick layer is demonstrated; even thicker layers have been obtained. Various characterization techniques including optical microscopy, X-ray techniques and photoluminescence are compared for the evaluation of the crystal quality and purity of the layers.

Abstract: 3C-SiC epilayers grown on Si-face nominally on-axis 4H-SiC substrate are characterized with X-ray diffraction techniques. The aim was to investigate if these 3C-SiC epilayers were grown by single domain growth. The results show that all samples start by having several nucleation centers all over the substrate surface and the growth continues with two domain formations. As the growth proceeds one domain overtakes the growth and single domain crystal growth occurs. This single domain was further investigated and the results show that it seems to contain many sub-domains with same lattice constant but slightly tilted.

Abstract: Results of surface preparation on Si-face 4° off-cut 4H-SiC substrates are presented in this paper. The influences of two types of etchants, i.e. hydrogen chloride (HCl) and only hydrogen (H2), were investigated by Nomarski microscopy and AFM. The experiments were performed in a hot wall CVD reactor using a TaC coated susceptor. Four etching temperatures, including 1580 °C, 1600 °C, 1620 °C and 1640 °C, were studied. In-situ etching with only H2 as ambient atmosphere is found to be the optimal way for the SiC surface preparation. Using HCl at temperature higher than 1620 °C could degrade the substrates surface quality.

Abstract: This study has been focused on 3C-SiC epitaxial growth on 4H-SiC (0001) on-axis substrates using the standard CVD chemistry. Several growth parameters were investigated, including growth temperature, in-situ etching process and C/Si ratio. High quality single domain 3C epilayers could be obtained around 1350 °C, with propane present during pre-growth etching and when the C/Si ratio was equal to 1. The best grown layer is 100% 3C-SiC and single domain. The net n-type background doping is around 2x10¹⁶ cm^-3. The surface roughness of the layers from AFM analysis is in the 3 to 8 nm range on a 50x50 μm2 area.

Abstract: The hetero epitaxial growth of 3C-SiC on nominally on-axis 4H-SiC is reported. A horizontal hot-wall CVD reactor working at low pressure is used to perform the growth experiments in a temperature range of 1200-1500 °C with the standard chemistry using silane and propane as precursors carried by a mix of hydrogen and argon. The optimal temperature for single-domain growth is found to be about 1350 °C. The ramp up-conditions and the gas-ambient atmosphere when the temperature increases are key factors for the quality of the obtained 3C layers. The best pre-growth ambient found is carbon rich environment; however time of this pre-treatment is crucial. A too high C/Si ratio during growth led to polycrystalline material whereas for too low C/Si ratios Si cluster formation is observed on the surface. The addition of nitrogen gas is also explored.