Papers by Author: Yasushi Kamimura

Abstract: In order to investigate flip-flop transitions of shear transformation zones (STZs) which are believed to be the elementary deformation sites in metallic glasses, internal friction measurements have been conducted for a commercial bulk metallic glass of a Zr-based alloy (Johnson alloy). Since the STZ is an asymmetrical two-level system, it is necessary to measure the internal friction at a high amplitude or under a bias stress condition to detect the transitions. Measurements have been made at temperatures between 130 K and 573 K at frequencies between 0.1 Hz to 10 Hz. The results showed that quite a broad peak appears between 200 K and 500 K in high amplitude internal friction measurements. The broad peak, observed for the first time in metallic glass, is interpreted to be due to flip-flop transitions of STZs having a broad spectrum, 0.5∼1.2 eV, of the activation enthalpy.

Abstract: Peierls stresses P of a variety of pure crystals, bcc metals, NaCl type crystals, elemental and compound tetrahedrally coordinated crystals, intermetallic compounds and ceramic crystals, have been estimated from the critical resolved shear stress (c) vs. temperature curves. For high P crystals where CRSS data are available only at high temperatures, P has been estimated from the critical temperature T0 at which steep temperature dependence of c vanishes: T0 is related to the kink-pair formation energy which is a function of P, material parameters and dislocation character controlling the deformation. The estimated p/G values are semi-log plotted against h/b value, where G is the shear modulus, h the slip plane spacing and b the Burgers vector. Two facts should be noted. First, P/G values for a group of crystals with the same crystal structure are within a range of a factor of 10. Second, most of the data points lie in between the classical Peierls-Nabarro relation and the Huntington’s modified relation. These facts indicates that Peierls stress is primarily determined by the crystal structure.

Abstract: This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.