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Papers by Author: Yoji Matsukawa

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Polishing Mechanism of Glass Substrates with its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

Authors: T. Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, S. Isayama, Yoji Umezaki, Yoji Matsukawa, H. Kono, Yoichi Akagami, Yasuhide Yamaguchi, Y. Kawase

Abstract: With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn2O3 abrasives potential to replace disappearing CeO2 for the polishing of glass substrates.

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Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container

Authors: Kei Kitamura, Toshiro K. Doi, Syuhei Kurokawa, Yoji Umezaki, Yoji Matsukawa, Yota Ooki, Tadashi Hasegawa, Isamu Koshiyama, Koichiro Ichikawa, Yoshio Nakamura

Abstract: We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.