Papers by Author: Yoji Umezaki

Abstract: While investigating polishing mechanism of glass substrates with ceria abrasives (CeO2), we found its oxidizing properties worked effectively for the polishing. This finding has inspired us to speculate about the possibility of the manganese oxide abrasives as an alternative for ceria as they also have oxidizing properties. Therefore, focusing on the valence of the manganese, we have experimentally manufactured MnO, MnO2, Mn2O3 and Mn3O4 abrasives, and conducted a comparison study of the characteristics obtained with ceria slurry and manganese oxide slurries. As a result, the surface roughness of below Ra 0.8nm obtained with Mn2O3 slurry was found better than that with the conventional ceria slurry, on top of which, its removal rate was as good as or equal to that of ceria. Using a novel, closed type CMP (Chemical Mechanical Polishing) machine, we conducted another glass polishing experiment with ceria and manganese oxide slurries. The inside of the CMP machine was filled with high-pressure gases such as oxygen, air and nitrogen and kept at 500kPa to make the polishing environment radical. Through this experiment, we found an effective polishing method for high-quality surface. The removal rates were several times better than that of the conventional polishing performed in an open CMP machine.

Abstract: With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn2O3 abrasives potential to replace disappearing CeO2 for the polishing of glass substrates.

Abstract: We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.

Abstract: The transient phenomenon of chip generations and behavior in the gear hobbing process are investigated by using a high-speed video camera. The chip behavior generated in gear finish hobbing process is very complicated and one can not identify each chip from specified cutting edges. The authors have built up a new simulation method of the hobbing process using a flying tool and a special-shaped workpiece, which consists of one tooth space. Visual evidences of the chip interference on the rake face and some conditions of contact between generated chips and the work surface were visually obtained. In the case of dry cutting conditon with a high-speed steel (HSS) flytool without coating on the rake face, the flytool cuts the workpiece frequently with the stuck chip generated in the previous revolution on the rake face. The newly generated chip pushes out the previous stuck chip, which flies away eventually. The chip flow on the rake face interferes strongly at the corner of the cutting edge when both top and side cutting edges produce different chips at the same time, and the chips flow out in changing the shape. The moving speed of the chip was also measured.