Papers by Author: Yu Fei Zhao

Abstract: The key question in the ice fixed abrasives (IFA) polishing is how to keep suitable ambient temperature in production process in order to avoid premature failure of the IFA. Based on above, the three dimensions finite element analysis (FEA) model of IFA polishing temperature field is built up at first. Then, the model reliability is demonstrated by experiments. Effects of ambient temperature and polishing time on temperature distribution and melting rate of the IFA pad are researched. The results show that the ambient temperature should be kept at about 10 °C in order to control the melting rate of the IFA pad effectively and keep longer polishing time. All the results provide the basis for choosing suitable ambient temperature in polishing.

Abstract: The exchange of the heat of the IFA polishing system was analyzed at first in this paper. Then the three-dimensional temperature finite element model was set up. By changing the material of the elements, the ice-melting process was simulated. It was found that the obtained simulating results showed a good agreement with the experimental results. The temperature distribution and the melting rate were studied in the case of different technical parameters, which can be used to provide references for choosing better parameters.

Abstract: The abrasive ice disc chemical mechanical polishing (AID-CMP) is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. In this paper we investigated the temperature field during GaAs wafer AID-CMP process for a better understanding of AID-CMP. The results show that the AID outer temperature is higher than the inner, and the highest temperature in AID is at the wafer/AID contact zone. The increases of Pc, v, eh and tp will generate more energy and cause more local melting during GaAs wafer AID-CMP process. The AID temperature and the area of highest temperature zone increase with increasing Pc, v, and eh. The nodes temperature increase in every conditions adopted as tp increases. The area of melted zone and thickness of melted ice increase with increasing Pc, v, eh and tp.