Papers by Author: Zhi Ming Han

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Abstract: Simulation analysis of thermal performance for vacuum glazing was conducted in this paper. The heat conduction through the support pillars and edge seal and the radiation between two glass sheets were considered. The heat conductance of residual gas in vacuum gap was ignored for a low pressure of less than 0.1Pa. Two pieces of vacuum glazing with sizes of 0.3 × 0.3 m and 1.0 × 1.0 m were simulated. In order to check the accuracy of simulations with specified mesh number, the thermal performance of a small central area (4mm×4mm) with a single pillar in the center was simulated using a graded mesh of 41×41×5 nodes. The heat transfer coefficients of this unit obtained from simulation and analytic prediction were 2.194Wm-2K-1 and 2.257Wm-2K-1 respectively, with a deviation of 2.79%. The three dimensional (3D) isotherms and two dimensional (2D) isotherms on the cold and hot surfaces of the specimens were also presented. For a validity of simulated results, a guarded hot box calorimeter was used to determine the experimental thermal performance of 1.0m×1.0m vacuum glazing. The overall heat transfer coefficients obtained from experiment and simulation were 2.55Wm-2K-1 and 2.47Wm-2K-1 respectively, with a deviation of 3.14%.
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Abstract: Laminated glass and photovoltaic laminated glass are widely used in architecture. The interfacial bonding strengths between poly(vinyl butyral) (PVB) and glass were investigated by the cross-bonding method from room temperature to -50 °C. The loading speed was 5 mm/min, and the cooling speed was about 0.5 °C/min. The testing sample was hold at each temperature for half an hour. It was revealed that the testing temperature had great effect on the bonding strength. At room temperature, the tensile bonding strength was 11.49 MPa and the shear bonding strength was 6.61 MPa. With the temperature decreased from RT to -50 °C, the tensile bonding strength was decreased by 66.81%, but the shear bonding strength was increased by 212.16%. From RT to -30 °C, the change rates of the tensile and shear bonding strength bonding strength were 65.57% and 172.68% respectively, only 3.61% and 14.48% from -30 °C to -50 °C. The mechanism for the bonding strength depended on testing temperatures from RT to -50 °C was also discussed.
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