Papers by Keyword: Buried Layer

Abstract: This paper applied the Taguchi method to simulate the latch-up effect of nLDMOS to achieve an optimization design. The applied model is for an nLDMOS structure with high voltage well plus the adaptive (adjustment) layers of source & drain, and an N-type buried layer. Although the methods we could choose is abundant, we hope to effectively obtain the data which is useful for statistics in order to judge the correct characteristic of parameters. We applied the Taguchi method to perform an optimization in the paper. There are six parameters with two levels in this work, so we choose the Taguchi table to be L₈(2⁷). By this way, it can decrease the times of experiment much effectively.

Abstract: The peculiarities of a buried layer formation obtained by a co-implantation of O2 ions with the energy of 130 keV and carbon ions within the energy range of 30-50 keV have been investigated. The corresponding ion doses for carbon and oxygen ions were equal to 2∙1016 cm-2 and 1.8∙1017 cm-2, respectively. It has been observed that annealing at 1150°C results in enhanced oxygen diffusion towards the region with a maximum carbon concentration. Analysis of x-ray diffraction patterns and TEM images confirm formation of Si nanoclusters in the SiO2 buried layer. The intensive luminescence with the maximum at 600 nm has been observed in the synthesized structures.

Abstract: The effect of treatment at up to 1400 K (HT) under enhanced hydrostatic pressure (HP, up to 1.2 GPa) on helium implanted single crystalline silicon (Si:He, He ion dose up to 6x1017cm-2, energy up to 300 keV) has been investigated by transmission electron microscopy, secondary ion mass spectrometry, photoluminescence and X-Ray methods. The treatment of Si:He at ≤ 920 K - HP results in a formation of buried nano-structured layers containing helium filled cavities/bubbles and numerous extended defects; many less dislocations are created at ≥ 1270 K in Si:He treated under HP. HP affects the recrystallization of amorphous Si, diffusivity of implanted He and of implantation-induced defects and thus promotes the creation of more but smaller He-filled cavities/bubbles as well as other defects near the range of implanted He+.