Papers by Keyword: C-Face SiC

Abstract: For improving the productivity of the semiconductor silicon carbide power devices, a very large diameter wafer process was studied, particularly for the non-plasma wafer etching using the chlorine trifluoride gas. Taking into account the motion of heavy gas, such as the chlorine trifluoride gas having the large molecular weight, the transport phenomena in the etching reactor were evaluated and designed using the computational fluid dynamics. The simple gas distributor design for a 200-mm-diameter wafer was evaluated in detail in order to uniformly spread the etchant gas over the wide wafer surface.

Abstract: A 50-mm diameter silicon carbide wafer thinning technique by means of a chemical reaction using a chlorine trifluoride (ClF₃) gas was studied accounting for the gas distributor design and the total gas flow rate. The entire etching depth profile could become uniform with the increasing total gas flow rate at the fixed chlorine trifluoride gas concentration. A relationship between the pinhole arrangement of the gas distributor and the local etching rate profile was clarified by comparing the quick calculation and the measurement.

Abstract: Graphene samples were grown on the C-face of SiC, at high temperature in a furnace and an Ar ambient, and were investigated using LEEM, XPEEM, LEED, XPS and ARPES. Formation of fairly large grains (crystallographic domains) of graphene exhibiting sharp 1x1 patterns in m-LEED was revealed and that different grains showed different azimuthal orientations. Selective area constant initial energy photoelectron angular distribution patterns recorded showed the same results, ordered grains and no rotational disorder between adjacent layers. A grain size of up to a few mm was obtained on some samples.

Abstract: The growth of epitaxial graphene on C-face 6H-SiC substrates is investigated using pro-cess conditions that can form small, local areas of graphene. The thickness of SiC lost to Si sublimation is not completely countered by the thickness of the resulting graphene and so graphene-covered basins (GCBs) are formed. The GCBs are most likely nucleated at threading dislocations from the substrate. The GCB morphology exhibits ridges, similar to those found on continuous films. The GCBs expand through erosion of the surrounding SiC substrate walls, eventually coalescing into continuous films. The ratio of the Raman D and G peaks was used to estimate the crystallite length scale and it was found to be about 200 nm for small GCBs and > 1 m for continuous films.