Papers by Keyword: CTLM

Abstract: Due to their low leakage current, low noise levels, high thermal conductivity, and potential radiation hardness, SiC devices offer various advantages over Si devices in certain applications. As a result, they are being considered for operation in harsh environments, such as plasma diagnostic systems in future nuclear fusion reactors or in high energy physics applications. We report on relevant results of the GRACE project, which seeks to deliver a new generation of SiC sensors with graphene-enhanced contacts. Such devices are aimed to be radiation-hard and functional at high temperatures. The work presented in this paper focuses on the optimisation of the electrical contacts, along with the electrical characterisation and radiation-tolerance assessment of the first sensor prototypes produced.

Abstract: In this work, we have investigated triple and innovative multiple stacked contacts onto ptype SiC in order to evaluate whether or not there is any improvement in morphology or specific contact resistivity. The stacked metal contacts are based on Al, Ti and Ni with the specific contact resistivity measured at a low value of 5.02×10-6'cm2 for an Al(100 nm)/Ti(100 nm)/Al(10 nm) (where a “/” indicates the deposition sequence) triple stacked metal contact. XRD microstructural analysis and SEM measurements have been carried out and it has been discovered that the contacts, which formed the compound Ti3SiC2 at the metal/SiC interface, more readily display low-resistance ohmic characteristics after a post deposition anneal. Although the same amount of Ti (100 nm in total) has been deposited closer to the metal/SiC interface, none of the multiple stacked structures displayed ohmic behaviour after a post deposition anneal.

Abstract: The formation of metal/diamond Ohmic contacts is essential to most electronic devices. In order to form a good Ohmic contact to diamond a carbide-forming metal such as Ti or Cr is necessary. In this study, Cr/Au contacts to heavily boron-doped single crystal CVD diamond were fabricated by subsequent deposition of Cr and Au. The surface morphology and specific contact resistance of diamond/Cr/Au contacts has been investigated. The reaction between the Cr metal and the diamond during annealing gives an improved specific contact resistance. However, this reaction also causes a significant change in the surface morphology. The surface morphology of singlecrystal diamond is shown to greatly influence the properties of metal contacts to diamond. Shearforce mode atomic force microscopy (AFM) investigations have been used to examine the diamond surface before metallization, and after removing the metal contact. The initial diamond surface was predominantly smooth, apart from some scratches from the polishing process. Surface RMS roughness values of around 0.4nm were found. Correlation between surface morphology and contact resistance has been found, with rougher surfaces exhibiting a barrier to conduction. An understanding of the contact formation process is an essential step in achieving high quality Ohmic contacts which are vital in the fabrication of high quality diamond devices.