Papers by Keyword: Cleaning Efficiency

Abstract: Mould cleaning process is the process of removal build-up deposited or residue material on the mould surface after repeated cycles of production. The currently used mould cleaning process is sand blasting (abrasive process) and dry rubber mould cleaning compounds (depends on the skill of the operators during rubber compounding). Latex laminated compounds will be beneficial as a new substitute for mould cleaning because of its excellent strength properties and the lamination process to increase its thickness. The main focus of this research is to investigate the effect of lamination process on mechanical properties and mould cleaning efficiency of laminated Nitrile Butadiene Rubber (NBR) latex composites. Laminated NBR latex films with cleaning agent and waste latex compound was prepared by arranging half-cured latex sheets with various thicknesses of outer layer (NBR latex films with cleaning agent) and core layer (waste NBR latex film). The core and outer layers are prepared through casting method with different thickness. The laminated films were subjected to compression moulding using hot press at 120°C. Reinforcement of the core layer gives laminated latex composite with better mechanical properties, but excessive of core layer portion reduced the mechanical properties of laminated films. The efficiency of mould cleaning of laminated NBR latex films were depends on the flow ability and adhesion properties of the fresh latex layer with mould cleaning agent (outer layer).

Abstract: The installation position of nozzle directly affect the efficiency of high pressure water jet cleaning. In order to improve the cleaning efficiency, the paper establish the three-dimensional structure and numerical model of the original nozzle assembly and the spiral nozzle assembly. The numerical simulation results show that, on the same boundary conditions, the effective hit range of the spiral nozzle assembly is greater and more uniform than that of the original nozzle assembly.The effective surge pressure of the spiral nozzle assembly is larger than that of the original nozzle assembly, spiral nozzle assembly can can reduce the blind cleaning area and improve the cleaning efficiency.

Abstract: Megasonic cleaning traditionally refers to use of acoustic fields in the 800 kHz 1 MHz range to remove contaminants adhered to surfaces immersed in liquid media. However, even fields driven by frequencies in the > 400 kHz regime exhibit virtually all characteristics of conventional megasonics. These include: unidirectional pumped flow of liquid (acoustic streaming) normal to the transducer, at velocities that scale as square of frequency; and, a near-absence of cavitational phenomena associated with ultrasonic cleaning. For the latter reason, megasonic cleaning is preferred over ultrasonics when attempting to remove contaminants from delicate, fragile, erodible or feature-rich surfaces. Silicon wafer cleaning in semiconductor manufacturing, integrated circuit cleaning, and printed circuit board cleaning have utilized megasonics (with appropriate chemistry) for several decades. The megasonic frequency offers the additional benefit of a very thin boundary layer over the immersed surface, which effectively exposes even sub-micron and nanodimensional particles to the flow of the cleaning liquid.