Papers by Keyword: Cu Clean

Abstract: The time and stoichiometric ratio dependence on dissolution of Cu from Cu(I)O and Cu(II)O and metallic Cu was investigated for a series of known Cu chelators. This was monitored by ICP-OES and UV-VIS. A notable difference in the rate of reaction for Cu(I)O vs Cu(II)O was observed and the impact of a copper adduct precipitating from solution discussed as this may present a redeposition issue for Cu surface cleaning. Additionally these chelators were found to selectively favour Cu0 and typically showed higher solution levels of Cu when exposed to the oxides.