Papers by Keyword: Ductile Grinding

Abstract: To grind fused silica in ductile mode, it was proposed to repair surface and subsurface micro cracks of fused silica by CO₂ laser irradiation. However, excessive residual stress remains on the surface because the melt fused silica on the surface quenches in air. It causes the critical depth of cut for ductile grinding fused silica to be smaller than 0.2μm. To investigate the distribution of the residual stress and look for an optimal manner of irradiation to control residual tensile stress, a numerical model of was built for simulating the dynamic behavior of fused silica when irradiated by CO₂ laser. Laser energy absorption, heat transmission, viscoelastic behavior of fused silica and thermally induced stress were considered in the numerical simulation. The results show how the residual stress is formed and distributed. We found that an appropriate control of the temperature field as a function of time and position in the laser process is the key to reduce the residual stress. Therefore, three kinds of processes were proposed to reduce residual tensile stress on the surface of fused silica introduced by laser irradiation. The residual stress distributions of these three processes were compared by numerical analysis to decide a better method of laser irradiation.

Abstract: This paper reports on results of experiments on BK7 glass materials with a novel tool for fine grinding of faces for optical purposes. The ball-shaped toolcomprises of a plastic wheel, several elastic layers and a polyurethane compound with diamond abrasives, which was developed and provided by OptoTech. Removal test runs led to samples with very smooth surfaces without sub surface damages. The tool’s elastic properties enable dwell time assisted grinding.

Abstract: This paper aims to evaluate the surface and sub-surface integrity of optical glasses which were correspondingly machined by coarse and fine-grained diamond grinding wheels on Tetraform ‘C’ and Nanotech 500FG. The experimental results show that coarse-grained diamond grinding wheels are capable of ductile grinding of optical glasses with high surface and sub-surface integrity. The surface roughness values are all in nanometer scale and the sub-surface damages are around several micros in depth, which is comparative to those machined by fine-grained diamond wheels.

Abstract: In this paper, a novel conditioning technique features using copper bonded diamond grinding wheels of 91μm grain size assisted with ELID (electrolytic in-process dressing) as a conditioner to precisely and effectively condition nickel electroplated monolayer coarse-grained diamond grinding wheels of 151μm grain size was firstly developed. Under optimised conditioning parameters, the super abrasive diamond wheel was well conditioned in terms of a minimized run-out error and flattened diamond grain surfaces of constant peripheral envelope, with the conditioning force monitored by a force transducer as well as the modified wheel surface status in-situ monitored by a coaxial optical distance measurement system. Finally the grinding experiment on BK7 was conducted using the well conditioned wheel with the corresponding surface morphology and subsurface damage measured by AFM (atomic force microscope) and SEM (scanning electron microscope) respectively. The experimental result shows that the newly developed conditioning technique is applicable and feasible to ductile grinding optical glass featuring nano scale surface roughness, indicating a prospect of introducing super abrasive diamond wheels into ductile machining of brittle materials.

Abstract: This paper worked on two dimensional ultrasonic grinding system with workpiece adhered to ultrasonic vibration. It analyzed the working locus of abrasive particle under two dimensional ultrasonic grinding (TDUG), and emulated the working course, and gave the key parameters affecting grinding efficiency and grinding locus’s characteristic under different grinding parameters, and brought forward the cutting course between abrasive particle and workpiece under TDUG belongs to an new rotating dynamic contact cutting model. At the same time, it put forward the theoretically critical speed condition under TDUG to obtain the optimum grinding effect, and verified good micro-feature of finished surface under TDUG by the means of grinding tests of nano ZrO2 ceramics.

Abstract: On the basis of analyzing the brittleness, ductileity, and the removal mechanisms of the^nano-ZrO2 Ceramics, the critical ductile grinding depth formula of the nano-ceramics was established. Due to superductileity of the nano-ZrO2 ceramics, it couldn’t apply the formula of the common engineering ceramic material according to experimental results. The value of material coefficient ζ has relations with not only the material characteristics but also the processing methods and the processing parameters. It was proved that ζ has great effects on the accuracy of theoretical calculation. Experimental results showed that the critical ductility grinding depth of the nano-ZrO2 ceramics is up to 12 µm in common grinding methods, while in ultrasonic grinding is up to 20µm. The grinding chips with and without ultrasonic vibration assistance were discussed.