Papers by Keyword: Ductile Regime Machining

Abstract: Single-point fly cutting and nanoindentation test of quartz glass were performed using three different cutting tools, namely, a V-shaped cutting tool, a Vickers indenter and a spherical indenter, to investigate the elastic and plastic behaviors of quartz glass in ductile-regime machining. It was found that these behaviors depend on tool shape and that the V-shaped cutting tool is most effective for removing quartz glass material followed by the Vickers indenter and spherical indenter.

Abstract: The elastic and/or plastic behaviors of glass quartz, the most popular optical material and a hard and brittle material, were studied experimentally from two points of view; static mode and dynamic mode. The static behaviors were investigated by a nanoindentation test and the dynamic behaviors were investigated by a single-point fly cutting (SPFC) test. In the experiments, copper was selected as a material representing soft and ductile materials. From the experiments it was found that the plastic deformation ratio of glass quartz is smaller than that of copper depending on the SPFC conditions, and the area coefficient of the pile-up has the same tendency for both glass quartz and copper.

Abstract: Cryogenic polishing single silicon wafer with nano-sized CeO2 abrasives can be known as cryogenic fixed abrasives CMP (CFA-CMP). The abrasive slurry was made of nano-sized CeO2 particles dispersed in de-ionized water with a surfactant and the polishing slurry froze to form cryogenic polishing pad. Then the polishing tests of the blanket silicon wafers in the presence of the cryogenic polishing pad containing the nano-particulates were carried out. The morphologies and surfaces roughness of the polished silicon wafers were observed and examined on an atomic force microscope (AFM). The results show that a super smooth surface with roughness of 0. 293 nm is obtained within 5000 nm× 5000 nm and the removal of material is dominated by plastic flowage.