Papers by Keyword: Edge Profile

Abstract: This paper describes an atomic force microscope (AFM) based instrument for 3D edge profile measurement of single-point diamond cutting tools. The instrument is composed of an AFM unit and an optical sensor for alignment of the AFM probe tip (silicon cantilever) with the diamond cutting tool edge. In the optical sensor, a laser beam from a laser diode along the Y-axis is focused to generate a small beam spot with a micrometer-order diameter at the beam waist, and then received by a photo-detector (photodiode). The tool edge top and the AFM probe tip are brought to the center of the beam waist in the XZ-plane through monitoring the variation of the photodiode output, respectively. Consequently, the AFM tip can be aligned with the tool edge top. Alignment experiments and 3D edge profile measurements of a round-nose type single-point diamond tool are carried out.

Abstract: In order to improve form cutter accuracy in grinding process, a closed-loop control system was designed to accomplish adaptive control of constant force in grinding process. Since it is a complicated dynamic process with severe nonlinear and much stochastic disturbance, fuzzy adaptive controller was used which can adjust parameters online. By measuring grinding force, characteristic information of grinding process was acquired. Regulation factor of feed rate is determined by grinding force ratio, and force deviation and its change rate are used as evaluation indexes. Thus, adaptive control of constant force in grinding process is accomplished. Simulation and tool grinding test indicate that the system has high precision and stability, and reduces cutter error efficiently.

Abstract: This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.