Papers by Keyword: Electroless Copper Deposition

Abstract: Copper was selectively deposited on modified plastic without the palladium-catalyzed process. Laser direct writing was used to create the selective seeds.The effect of laser processing on the electroless copper deposition was investigated. Thus the morphologies and compositions of the sample before and after laser processing were investigated by means of sanning electron microscopy(SEM) equipped with an energy dispersive X-ray spectrometer(EDX) and X-ray photoelectron spectroscopy(XPS). The relationship between laser pulse frequency , scanning velocity and the topography of the deposited copper lines were also discussed

Abstract: Metallization treating on the plastic surface without the mask technology was created by using a new method combining the laser technique with the electroless copper deposition,this method get rid of palladium as catalyzer in the traditional chemical plating which is high cost and environment unfriendly. The samples are examined carefully by the scanning electron microscopy; resistance and adherence of the Cu plating were inspected and analysised. The result indicated that it was feasible to fabricate compact,uniform,and good conductive Cu plating on the plastic substrate by using potassium sodium tartrate and EDTA2Na as chelating agent; the resistivity of plating is related to the deposition time; adherence is influenced by laser power,the excellent adherence to plastics surface are obtained when the laser power exceeds 5W.