Papers by Keyword: Embed

Abstract: In this paper, we present a novel embed fluorescence method that allows one to monitor the change from emulsion polymerization to microemulsion polymerization with low monomer contents. The microemulsion polymerization of methyl methacrylate (MMA) was investigated using N-(2-anthracene) methacrylamide (AnMA) as the probe whose fluorescence emission intensity was proportional to the conversion of MMA into the polymer.In this research, the trace amount of AnMA unit looked like embed in the MMA chain. In a solution containing 3wt% of MMA with respect to water, with the anionic surfactant of sodium dodecyl sulphate (SDS) and water-soluble initiator of potassium persulfate (KPS), the process of changing from emulsion to microemulsion has been monitored. By contrast, with the non-ionic surfactant of polyoxyethylene (20) oleyl ether (Brij98) or water-insoluble initiator of 2,2′-azobis(isobutyronitrile) (AIBN), the process of changing from emulsion to microemulsion also have been monitored.

Abstract: With the development of computer network and information, digital product is more and more popular. So the problem of protecting the digital product's copyright is urgent and important. Digital watermarking contains the copyright information and authentication information, and protects legal copy and distribution of digital products, which has been the hotspot of international academia. The paper analyze digital watermarking technology, and discuss its various algorithm, point out their characteristic and disadvantages. A good digital watermarking algorithm need to implement blind extraction, robustness and resistance of noise attacks, JPEG compress attacks, geometric attacks etc. In the end, the paper a introduce the current state of this technique and propose several directions of development of digital watermarking at next stage.

Abstract: It presented a novel manufacturing method that was derived from traditional hot embossing technology to fabricate actuators on polymer material in this paper. The conventional photolithography technology, electroplating, and hot embossing technology were utilized in this process. The plastic deformation properties of thermoplastic polymers were main concept. The metal layer deposited on the silicon wafer could be embedded into the polymer substrate by hot embossing technology as temperature being above Tg. When the polymer substrate temperature was cooled below the Tg, the polymer is to de-embossing and remove silicon wafer. The metal layer was transferred from silicon wafer to be embedded in the polymer substrate. Owing to the adhesion between the metal layer and polymer material was more than the metal layer and silicon wafer. For instance, the PMMA was employed as the polymer substrate to fabricate the cantilever beam actuator using the novel technology. Finally, the beam was driven by electrostatic force through 25volts of DC power.