Papers by Keyword: Glass Plate

Abstract: A thick glass plate was cut by using hot wire. Crack growing was stopped when wire temperature was low. Ligament length decreased with increase in temperature of hot wire and full-cutting was achieved at the temperature of 650°C. The center region in the thickness direction seemed to propagate earlier compared to surfaces regions when the crack propagation was stopped. Finite element thermal stress analysis was carried out. According to distribution of thermal stress inside a glass plate, higher stress was generated in the bottom region at the beginning of the process but occurred in the center region in the later stage as matching with the experimental result.

Abstract: In the hole drilling process, produced chip cannot be released from the inside hole which leads to broken glass plate due to the adhered chip on tool. Chip discharge method was announced by many researchers. However, the method using the tool-only with drilling command is rarely seen. In this laboratory, we have developed a tool in order to discharge chip. The developed tool is capable in preventing chip adhesion and producing high quality and efficient hole drilling process. The developed tool has several hundred times longer tool life than a conventional tool. However, the amount of adhered chips on cutting tool increase as the number of hole drilling process increases. The chip adhesion condition is different according to the kind of grinding fluid. Adhesion of chips on tool can be related to the properties of grinding fluid. Thus, in this study, the types of grinding fluid used during the hole drilling process were investigated to determine the state of chip adhesion. Three types of grinding fluid used are Emulsion, Soluble and Solution and all of them include surfactant which is considered to have an effect on prevention of chip adhesion. The main conclusions obtained in this study are as follows. Chip adhesion state was investigated after drilling process and it was found that instead of grinding fluid properties, surfactant also has significant effect on chip adhesion on tool by absorbing the adhered chip from the tool. The results showed that grinding fluid with long-chain surfactant has small amount of chip adhesion whereas grinding fluid with short-chain surfactant has large amount of chip adhesion. Therefore, it can be concluded that grinding fluid with long-chain surfactant is capable in preventing chip adhesion during hole drilling process.

Abstract: Different thickness, length and shape ratios of point fixed glass in glass building were considered. Different numbers, position and radius of holes in glass were also considered. Point fixed glass was studied by the finite element method and ANSYS software. Results show the thickness has remarkable influences on the strength and stiffness. The maximal tensile stress and deflection increase quickly with larger size of square plates or ratio of width to length of rectangle plates. Plates with six holes have smaller maximal tensile stress and deflection than plates with four holes under the same other conditions. The maximal tensile stress and deflection decrease quickly with larger hole centre distance, and deceleration becomes slow. The largest tensile stress decrease quickly with larger hole radius, but the deflection and the stress on edges of plates decrease slowly.

Abstract: This work constitutes a damage detection study of a glass plate using the statistical approach of outlier analysis, which is also referred to here as novelty detection. A glass plate instrumented with low-profile, surface-bonded transducers is used in the investigation. Ultrasonic Lamb waves are applied for detecting various crack length on the same plate. The study reveals a distinction between the damage and undamaged plate, and also assesses the severity of damage.

Abstract: Elastic deformation machining is a new developing machining method for machining aspheric optical workpieces. Fracture property of glass plate under uniform pressure has important influence on the design of mould which is the key part of elastic deformation machining. In this study, to explore the fracture property of glass plate under uniform pressure, the deformation property of glass plate under uniform pressure is analyzed, a fracture experiment of glass plate using vacuum absorption is carried out on a self-developed “fracture testing system” and the values of critical vacuum degree is fit to Weibull distribution. Results show that fracture of glass plate under uniform pressure is comminuted, and for glass plate with depth of 1.95mm and diameter of 96mm, the relative safe value of maximum center offset of the mould’s profile is 0.5mm.

Abstract: Through a case of glass plate cutting, two-dimensional cutting pattern problem of rectangular blanks is discussed. The raw material is cut and layout by applying the method of grouping and two-stage cutting pattern types. Here first all the blanks are divided into different groups based on certain requirement, and then two-dimensional cutting pattern problem is transformed into two one-dimensional cutting problems. Through constructing an integer programming model, the cutting program of the raw material can be obtained step by step by calculating in LINGO. Because here the precise algorithm of integer programming is applied, which is not the time algorithm of polynomial, in the specific implementation, there shouldn’t be more variables, so all the data should be divided into different groups to calculate. In each group, there should be no more than 6 blanks, which are grouped according to their size. This algorithm is simple and easy to operate with a high material usage.

Abstract: With simple screen-printing method, the short-stripe insulation wall was fabricated. In the manufacture course, the insulation slurry was printed on the cathode glass plate surface. After the sintering process, the short-stripe insulation wall with better insulation performance would be formed. For the field emission display panel, the short-stripe insulation wall mainly possessed good separation action and support function, which not only was profitable for the subsequent panel exhausting, but also its simple fabrication process was also confirmed. Using carbon nanotube as field emitters, the field emission display panel was developed, which showed good field emission properties, such as good uniformity and image display function.

Abstract: Hard and brittle materials such as ceramics and glass are not only difficult-to-machine but also occur easily cracks at the exit surface in through-hole drilling. This paper deals with through-hole drilling of glass plate for plasma display panel using an electroplated abrasive grain tool in order to find out drilling conditions for smaller cracks, higher drilling efficiency and longer tool life. In particular, the influence of the crack in two kinds of abrasive grain is examined. The main conclusions obtained in this study are as follows. The crack in diamond grain tool is smaller than that in CBN grain tool. Moreover, the tool life of diamond grain tool is longer than that of CBN grain tool. Adhered volume of chip increases with drilling numbers, so the crack size and the thrust force increases. The washing of tool is required in order to restrain crack and force.

Abstract: Phase-shifting digital holography can be used for displacement measurement instead of strain gauge. Our research group is developing the measurement equipment for phase-shifting digital holography. Generally, in the measurement equipment, piezo stages are used as phaseshifting devices. But the piezo stage is expensive. Cheaper and smaller phase-shifting device is required in order to put the measurement equipment into practical use. In this paper, we, therefore, propose a phase-shifting device using the deflection of a cantilever and we verify whether this phase-shifting device can be used
for digital holography.