Papers by Keyword: Ground Surface Topography

Abstract: The present article deals with the surface topography during high speed grinding of particulate reinforced titanium matrix composites (PTMCs). Scanning electron microscopic images of the ground surface was analyzed. Combining the results presented in this paper, the following results could be summarized: (1) The reinforcing particles of PTMCs are removed by means of voids, pulled-out, fracture or crushed, and micro-cracks, which attributed to the plowing and shearing during high speed grinding. (2) The formation of the fracture pattern of PTMCs is formed due to the wear debris of the abrasion during high speed grinding.

Abstract: Two grinding methods, parallel grinding and cross grinding, were applied to the horizontal-axis-type rotary surface grinding of silicon and tungsten carbide. It was found that the cross grinding method results in better ground surface roughness than parallel grinding for the silicon wafer and that an isotropic ground surface topography is achieved for both silicon and tungsten carbide by cross grinding.