Papers by Keyword: Horizontal-Axis-Type Rotary Surface Grinding

Abstract: Two grinding methods, parallel grinding and cross grinding, were applied to the horizontal-axis-type rotary surface grinding of silicon and tungsten carbide. It was found that the cross grinding method results in better ground surface roughness than parallel grinding for the silicon wafer and that an isotropic ground surface topography is achieved for both silicon and tungsten carbide by cross grinding.