Papers by Keyword: ICP Etching

Abstract: BaTiO₃ crystal film has the very high electro-optic effect, so it has important research value for thin film waveguide electro-optic modulators. In this work, BPM software is used to simulate the single-mode condition of ridge waveguide at first, then BaTiO₃ film waveguide structure is designed with suitable film thickness.BaTiO₃ waveguide thin films are grown by pulsed laser deposition on single crystal MgO substrate. The BaTiO₃ thin-film crystalline structures grown at different temperature sand different laser powers were analyzed by using X ray diffraction , which showed the BaTiO₃ films have a priority crystallization direction and good crystallization quality at 750°C grown temperature. For the optimally-designed waveguide structures, the PECVD technique and ICP plasma etching method are employed to coat and etch Si₃N₄ films, respectively. Through the optimization of main process parameters, 60 sccm reaction gas flow and 150 nm/min etching speed are finally selected to create the ridge waveguides, and consequently, the surface roughness of Si₃N₄ film waveguide reaches 2.3 nm.

Abstract: InAs/GaSb superlattice in infrared detector was grown on GaSb substrates by molecular beam epitaxy technique. Using inductively coupled plasma (ICP) etching technique and Cl₂/Ar etching gas, the smooth mesa of the device was formed. The influence of etching time, Cl₂ percent and RF power on the etching rate and the surface morphology of InAs bulk, GaSb bulk materials and superlattice were studied. It showed that the etching rate of InAs was lower than that of GaSb and the etching surface was smooth at Cl₂ in the range of 20%~40%. The results will benefit to forming ohm contact and decrease surface leakage current in the photovoltaic detector.

Abstract: We have fabricated X-ray diffraction gratings for X-ray phase imaging using X-ray Talbot interferometer. In this paper, we propose the new low cost fabrication process using Si mold of Si dry etching and nano-imprint techniques. Si dry etching makes it possible to fabricate high aspect ratio rectangular microstructures. Therefore, this technique is expected to fabricate high precision grating pattern. In this paper, we propose the new low cost fabrication processes using Si mold of ICP-RIE and nano-imprint techniques. And, in order to form transparence imprint mold, we used thermal oxidation of Si mold. These demonstrations of thermal oxidation are promising method for high precision transparence imprint mold with low cost, and realized low cost optical device such as diffraction gratings.

Abstract: A simple and novel self-assembly based process is presented in this paper for the fabrication of gold triangular nanocavity arrays. This process combines nanosphere lithography (NSL) with some standard MEMS technologies. A carboxylated polystyrene (PS) nanosphere bilayer with a relatively large area is fabricated on silicon wafer as the starting template by spin-coating. Oxygen plasma etching, metal deposition and lifting-off of the PS upper layer are then orderly carried out for the formation of triangular space, which is made up of Cr film and the remaining PS nanoparticles. Then silicon etching is used to transfer the triangle pattern onto the silicon wafer. Finally, a 50 nm thick gold layer is deposited on the pattern to fabricate gold triangular nanocavity arrays. With this strategy, both the period and the cavity size can be adjusted independently. This will allow the tuning of the optical properties for desired application.

Abstract: In this paper, optimization of fabrication process for microneedles has been presented. Using inductively coupled plasma (ICP) etching technology, fabrication of out-of-plane hollow silicon microneedles for blood extraction has been carried out. Sharp tip microneedles with length 1100 µm were designed for fabrication. The fabrication of microneedles was not successful because the lumen section was fabricated first and then hole was created for fluid flow. Previously, using same fabrication method successful fabrication of microneedles was done for drug delivery with length 200 µm. This fabrication method is not suitable for long structure. Thus, the alternative microneedle fabrication steps using ICP etching have been developed and presented in this paper. These steps can be more optimized and suitable for sharp tip, long and hollow structure.