Papers by Keyword: IC Manufacturing

Abstract: A laser annealing system for the CMOS IC processing is setup, consisting of a solid-state laser, a beam delivery system, a 2D movable wafer stage, an auxiliary heating system, and a chamber that holds all the above modules. The complexity of the system makes it much difficult to achieve a stable performance. Each related process factor is deliberated, and the strategies controlling of theses process parameters are then determined. A reconciling control method to balance the effect of laser energy density and laser beam shape is considered to maximize total production and reliability. A piece of Matlab code is programmed to assess the controlling effect. We found from running the system that after combining these strategies, system stability is improved, and desirable laser annealing process effects can be promised.

Abstract: Ink marking is a key process for die sorting of IC wafer manufacturing. Intensive production of wafer is urging the inkers for more rapid and more stable ink marking performance on surface of defective wafer dies safely. In this paper, a non-contact jetting dispenser is introduced to the wafer die marking. After presenting the mathematical description of dynamic fluid for 2-phase flow, numerical simulations are launched to reveal the characteristics of droplet generation and key factors are discussed. A jetting dispenser is developed and experimental results are analyzed. According to the simulative results and the dotting performance shown in experiments, the non-contact jetting dispenser is capable for wafer die marking in dotting efficiency and stability.