Papers by Keyword: IR Camera

Abstract: Selective laser melting (SLM) is a modern method for producing objects with complex shape and fine structures in one working cycle from metal powders. Combination of the advanced technology of SLM with unique properties of Ti6Al4V alloy allows creating complex 3D objects for medicine or aerospace industry. Since properties of SLM parts depend on the geometrical characteristics of tracks and their cohesion, optical monitoring is actually used to for control the process. Temperature gradient determines the microstructure and mechanical properties of the SLM part, so studies about temperature fields are primarily important. On-line monitoring during laser scanning of Ti6Al4V alloy and formation of a single track in real-time with high-speed IR camera was studied. Numerical simulation allowed estimation the temperature distribution during processing. Conclusion regarding control system based on the online monitoring of deviations of the signal from IR camera during the SLM process was done.

Abstract: An efficient methodology of electro-thermal design of smart power semiconductor devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for 2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and high power elements, temperature sensors, IC chips simulation are considered.

Abstract: In this study, the junction temperature (T_j) and thermal resistance (R_th) of five high-power multi-chip COB (chip-on-board) LED packages with different chip spacings were compared. The actual T_j was measured by an IR camera and compared with the simulation results from a computational fluid dynamics (CFD) software. In addition, the effects of heat slugs with different thermal conductivity, heat sinks of various thicknesses, chip size, and forced convection cooling on the T_j and R_th of high-powered LED components were investigated. The experimental results show that smaller chip spacing resulted in higher T_j and R_th. The heat dissipation performance can be improved by using a heat slug with a high thermal conductivity; and increasing the thickness of the heat sink, or employing forced convection cooling.

Abstract: Vibrations during lathe machining include vibrations by a sudden clash of a tool against a workpiece as an external excitation, vibrations by irregular tissues of the workpiece, vibrations by regular excitation due to asymmetric torque, and vibrations by bearing defects. Furthermore, machine tools are heated because most of the supplied energy is transformed to heat and becomes the heat source of the machine tool or an internal heat source. In addition, the spindle is one of the largest internal heat sources. The heat distortion of the spindle by this heat source has the most serious effect on the total heat distortion of the machine tool, and the heat distortion of machine tools is the largest cause of the degradation of cutting precision. In order to obtain accurate data about the causes of such vibrations and heat, this study measured the vibrations and thermal changes of each specimen using a vibrometer and an infrared thermography camera.

Abstract: We have detected defects micro-pipes and a cluster of impurities in semi-insulating 6H-SiC substrates using long-wavelength infrared thermal imaging camera (IR-camera) with 8 ~ 14 µm in non-destructive and non-contact. Also we have evaluated the thermal influence of defects on the entire substrates from the observation results of scanning laser microscope (SLM) and light scattering tomography (LST). Through the process, it was certificated that the defects in the substrates could be detected with relatively macroscopic scale (8  6 mm2). Moreover, through a temperature profile processing by a 0.1 K thermal resolution, we estimated thermal behavior of the defect areas in the 6H-SiC precisely. The IR-camera is considered as effective technique for evaluating the defects in the intermediate range between micro and macro scale.