Papers by Keyword: Interfacial Fracture

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Abstract: For nanoscale devices and structures, interface phenomena often dominate their overall thermal behavior. The feature scale of material interfaces usually originate from nanometer length and present a hierarchical nature. Considering to the limitations of the continuum mechanics on the characterization of nano-scale, the multiscale model featuring the interface could be very important in materials design. The purpose of this review is to discuss the applications of multiscale modeling and simulation techniques to study the mechanical properties at materials interface. It is concluded that a multi-scale scheme is needed for this study due to the hierarchical characteristics of interface.
491
Abstract: The interface is the area where two type of materials are connected, the strength and property of interface are important for the application of the clad. In this paper, interfacial strength and fracture properties of stainless steel-aluminum clad are analyzed with the methods of interfacial shear test and four point bending test, and the interfacial crack and the interfacial fracture structure are analyzed with SEM. The results show that the bonding of stainless steel and aluminum is successfully realized by explosive welding, the interfacial shear strength reach 70.90MPa, and the interfacial energy release rate is 1.725 MPa•m, the thickness of transition layer is about 10μm at the interface, the interfacial fracture happen and extend in the transition layer along the interface and the interface fracture structure is inclined to brittle fracture.
1803
Abstract: In order to reduce vehicle weight and improve crash performance, dual-phase (DP) steels are increasingly used for lightweight auto-body. the high cooling rates in Resistance spot welding (RSW) process will make the nugget very brittle and result in interfacial fracture modes. In this study, a servo resistance welding system is firstly introduced to control process parameters during the welding process. The influences of different process parameters (weld current, weld time and electrode force) on the weld strength, nugget diameter, facture modes and weld indentation are analyzed. Finally, an on-line weld failure mode inspection method is proposed based on servo gun’s feedback characteristics.
553
Abstract: The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.
66
Abstract: The aim of the present paper is to evaluate the interfacial fracture toughness of an Al/Epoxy adhesive system with a crack lying at the interface. A cracked lap shear specimen loaded in four point bending is adopted and the fracture toughness is pointed out in terms of the critical complex stress intensity factor. To this aim numerical analyses of the fracture specimen have been carried out using a commercial finite element code. In addition, fracture surfaces are analyzed and the locus of failure is discussed.
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