Papers by Keyword: Large Grain

Abstract: Stress measurement on samples with texture and large grains is always a challenge. The diffraction peak intensity varies dramatically with different sample orientation. The macroscopic elasticity becomes anisotropic due to strong preferred orientation. The large grains may results in a big error in 2θ due to poor sampling statistics. The fitting results of the conventional sin²ψ method is extremely sensitive to texture and large grains. When stress is measured with a 2D detector, most of the above adverse effects can be minimized or eliminated. The data integration helps to smooth out rough diffraction profiles due to large grain size, texture, small sample area or weak diffraction. The large angular coverage and multiple diffraction rings can minimize the effect of the macroscopic anisotropy. The weighted least squares regression and intensity threshold can further reduce the effect of poor statistics associated with texture and large grains. Multiple {hkl} rings may be used to measure the stress to improve the statistics and minimize the elastic anisotropy effect.

Abstract: Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.