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Articles by keyword: «Material Removal Mechanism»

• A Novel Superfine Machining Technology Based on the Magnetorheological Effect of Abrasive Slurry
  Published in: Advances in Materials Manufacturing Science and Technology II (p145)
• A Study on Erosion Mechanisms of Quartz Crystals Polished by Micro Abrasive Waterjet
  Published in: Precision Surface Finishing and Deburring Technology (p195)
• An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu
  Published in: Advances in Grinding and Abrasive Technology XV (p354)
• Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior
  Published in: Physical and Numerical Simulation of Material Processing VI (p313)
• Comparative Study on the Materials Removal Mechanism of Ceramics and Steels
  Published in: Advances in Abrasive Technology XI (p18)
• Development of Theory Model in Chemical Mechanical Polishing
  Published in: MEMS, NANO and Smart Systems (p767)
• Gap Phenomena of Ultrasonic Vibration Assisted Electrical Discharge Machining in Gas
  Published in: Advances in Machining & Manufacturing Technology IX (p500)
• Influence of Ultrasonic Assistance on Material Removal Mechanism of Hard and Brittle Materials Based on Single-Point Scratch
  Published in: Advances in Grinding and Abrasive Technology XVI (p413)
• Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC
  Published in: Ultra-Precision Machining Technologies (p209)
• Material Removal Mechanisms Involved in Rotary Ultrasonic Machining of Brittle Materials
  Published in: Advances in Abrasive Technology IX (p391)
• Mechanisms of Al/SiC Composite Machining with Diamond Whiskers
  Published in: Progress in Abrasive and Grinding Technology (p165)
• Micro Abrasive Jet Machining of Silicon Carbide (SiC) Fiber Reinforced Ceramic Matrix Composite
  Published in: Advances in Abrasive Technology XIII (p946)
• Research on Material Removal Mechanism of Magnetorheological Finishing
  Published in: Advances in Materials Manufacturing Science and Technology II (p133)
• Research on the Material Removal Mechanism in Deliquescent Polishing of KDP Crystals
  Published in: Advances in Grinding and Abrasive Technology XV (p487)
• Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer
  Published in: Digital Design and Manufacturing Technology (p658)