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Articles by keyword: «Material Removal Mechanism»

• Study on Chemical Mechanical Polishing Mechanism of LiTaO₃ Wafer
  Published in: Advances in Grinding and Abrasive Technology XIII (p310)
• Study on Contact Mechanism of Interface in Wafer CMP Based on Abrasion Behavior
  Published in: Advances in Grinding and Abrasive Technology XIV (p254)
• Study on Fixed Abrasive Lapping Technology for Ceramic Balls
  Published in: Advances in Materials Manufacturing Science and Technology II (p460)
• Study on Lubricating Behavior in Chemical Mechanical Polishing
  Published in: Advances in Grinding and Abrasive Technology XVI (p243)
• Study on Material Removal Mechanism in Creep Feed Grinding of Alumina Ceramics
  Published in: Advances in Grinding and Abrasive Processes (p347)
• Study on Material Removal Mechanism of Silicon Nitride during ELID Ultraprecision Grinding
  Published in: Advanced Manufacturing Technology (p1740)
• Study on the Material Removal Mechanism of Precision Surface Grinding of Nanostructured WC/12Co Coating
  Published in: Advances in Abrasive Technology IX (p99)
• Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing
  Published in: Digital Design and Manufacturing Technology (p724)