Papers by Keyword: Metal-Bonded Grinding Wheel

Abstract: A new complex grinding method named Ultrasonic Electrodischarging Grinding Method (US-ED-G in short) is described. In the US-ED-G, ultrasonic grinding and ED grinding are simultaneously carried out on an electrically conductive workpiece with a metal bond grinding wheel. When compared with other complex grinding methods, the US-ED-G is remarkably effective in reducing grinding force a great deal and maintaining grinding ability of a wheel for a long time in efficient grinding of extremely hard-to-grind ceramic materials like TiB2. A stock removal rate of 200mm3/min and a grinding ratio of 110 have been attained by selecting appropriate conditions in US-ED-G of TiB2. A compact and rigid ultrasonic attachment is also described, which was developed as a removable tool for carrying out US grinding and US-ED-grinding on a machining center or a grinding center.

Abstract: For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.