Papers by Keyword: Micro-Punching

Abstract: Electromagnetic micro-punching is a novel micro-punching process in which metal foil occur plastic deformation until shear fracture under magnetic impact load. In this paper, electromagnetic micro-punching process was investigated on T2 copper foil. Effects of discharge energy, foil thickness and discharging time on micro punching were discussed. The results show that micro holes were successfully pierced with the discharge energy more than 5.0 kJ on copper foil of 20 μm in thickness. Foil thickness is the main factor in electromagnetic micro-punching with the discharging energy of 7.2 kJ. In addition, increasing discharging time can punch micro hole on thicker foil. The micro holes with diameter of 0.4-1.4 mm were successfully punched on 20 μm copper foil in thickness with discharge energy of 7.2 kJ.

Abstract: This study presents an innovative imprinting method to fabricate IC devices by micro-punch process. Normally, imprinting method is used to imprint plastic materials such as photoresist and polymeric materials. In this study, imprinting process is applied to micro-punch metallic materials directly for IC devices. Fabrications of IC devices with high aspect ratio structures ranging from micrometer to sub-micrometer are described. In this study, to keep the production costs as low as possible, a complete micro-punching process is applied to replicate IC devices. A combination of lithography, extra-hard alloy nickel cobalt (Ni/Co) electroplating process (as a metal imprint mold for punch) and chemical mechanic polishing (CMP) process is used to flat the extra-hard alloy micro-punch head. It is worth noticing that the Ni-Co electroplating process with hardness over Hardness of Vicker (Hv) 560 is developed. With such hardness, it can stand the high pressure and abrasivness to confine the accuracy during micro-punching process. With regard to the electroplating process, Ni-Co is deposited and covered on the photoresist template uniformly by electroplating. The Ni/Co mold is served as master for micro-punching process to replicate the pattern onto polyimide (PI) or copper sheets. Finally, the experimental results are measured and characterized.