Papers by Keyword: Microelectronic Package

Abstract: In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analyzed.

Abstract: The μ-via in microelectronic substrate should have multiple purposes, one of them is to allow to the path of signal or current from electronic devices. The micro void can be easily formed in μ-via because μ-vias are filled with a screen printing process and the size of via is small. The residual void has been known as crack initiation of copper layer during a reliability test. The solder resist filling process and the behavior of a residual void in μ-vias were investigated. The void extraction process was very effective comparing with the conventional process to remove a residual void. As extracted with 1.5 atm for more than 30 sec, the residual void in μ-BVH was perfectly eliminated.