Papers by Keyword: Microtechnology

Abstract: Microtechnologies have been vigorously developed recently. Micro products have been widely used in many fields, for instance, the sensors in electronic, medical, optical and automotive applications. Thermocouples, which are used for temperature measurement, are usually fabricated by utilizing the joining technology of argon arc welding. However, the weld bead is so big that the conductivity and repeatability of temperature signals would be degraded. Laser welding may fix the weld bead problem, but the cost of equipment is relatively high. This study is about butt-welding thin brass wire of 250 m by mean of micro discharge. At first a low temperature plasma torch is formed to ignited arc, then discharge happens to complete the welding. Argon is added at ambient atmosphere during the welding process. The joined interfaces and heat affect zone of the welding is examined by optical and scanning electronic microscopies. Tensile and hardness tests as well as the microscopy examination indicate that this technology is feasible for thin brass welding. The features of this technology include low cost, easy to maneuver, and applicable in industry. This CIMDW technology offer choice for the applications of micro discharge in the field of microtechnology.

Abstract: The present paper deals with the questions of development and expected parameters of tunable multiplex-optical filters which use the combination of two interference optical filters - with one of high and with the first interference orders.

Abstract: Shape memory alloy (SMA) films enable the development of novel mechanically active microsystems as they provide large force and stroke in restricted space. The performance of SMA film actuators and sensors does not only depend on SMA material properties, but also requires a mechanically and thermally optimized design as well as a suitable fabrication technology being compatible to existing microsystems technologies. The paper gives an overview on the engineering aspects of SMA film actuators and sensors. These aspects are illustrated by selected examples such as bridge microactuators, microvalves and microscanners. The examples demonstrate the ongoing progress in the field, current limitations as well as existing opportunities for emerging new applications.

Abstract: Metrology plays an important role in the development and commercialisation of micro and nanotechnology. For calibrating versatile micro- and nanoscale standards, a dimensional metrology instrument coupled with multi sensor heads including atomic force microscope (AFM), tactile stylus, laser focus sensor and assembled cantilever probes (ACPs) has been developed. Two kinds of ACPs are highlighted in the paper. One is fabricated by gluing a vertical AFM cantilever to a horizontal AFM cantilever using micro assembling techniques. It is applicable for direct and non-destructive measurements of sidewall surfaces. The other is an ACP ball probe designed for true 3D measurements of micro structures. It is realised by gluing a tungsten wire with a probing sphere ball, 40 ... 120 µm in diameter, to a horizontal AFM cantilever. The ACP ball probe has advantages such as small probing forces (<1µN) and high probing sensitivity. Some typical calibrations on micro and nano structures such as step height, grating and sphere calotte artefact are introduced.