Papers by Keyword: Nanometric Machining

Abstract: The effect of interatomic potentials on the onset of plastic deformation in the nanometric machining of a crystalline diamond tool on a crystalline copper workpiece, was investigated by using the MD simulation. Three potential pairs were used for the copper-copper (workpiece) and the copper-carbon (tool-workpiece interface) atomic interactions. For case 1, the Morse potential was used for both the copper-copper and the copper-carbon interactions; for case 2, the Embedded Atom Method (EAM) potential was used for the copper-copper interactions and the Morse potential was used for the copper-carbon interactions; and for case 3, the EAM potential was used for the copper-copper interactions and the Lennard-Jones (LJ) potential was used for the copper-carbon interactions. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. From the simulation results, pile-up volume and the force ratio appear to indicate the onset of plasticity during the machining. The pile-up volume shows that ploughing starts from 0.25nm, 0.20 and 0.30nm depth of cut for case 1, case 2 and case 3 respectively and the formation of chips starts to occur from the depth of cut of 1.5nm for case 3. The force ratio also indicate the onset of ploughing at different depths of cut from 0.10nm-0.3nm.

Abstract: The Minimum Depth of Cut (MDC) is a major limiting factor on achievable accuracy in nanomachining, because the generated surface roughness is primarily attributed to the ploughing process when the uncut chip thickness is less than the MDC. This paper presents an evaluation of a cutting process where a sharp diamond tool with an edge radius of few atoms acts on a crystalline copper workpiece. The molecular dynamics (MD) simulation results show the phenomena of rubbing, ploughing and cutting. The formation of chip occurred from the depth of cut thickness of 1-1.5nm.

Abstract: The multi-pass nanometric machining of copper with diamond tool was carried out using the Molecular Dynamics (MD) simulation. The copper-copper interactions were modelled by the EAM potential and the copper-diamond interactions were modelled by the Morse potential. The diamond tool was modelled as a deformable body and the Tersoff potential was applied for the carbon-carbon interactions. It was observed that the average tangential and the normal components of the cutting forces reduced in the consecutive cutting passes. Also, the lateral force components are affected by atomic vibrations and the cross sectional area during the cutting process.

Abstract: An atomic force microscope (AFM) with suitable tips has been used for nano fabrication/nanometric machining purposes. In this paper, acoustic emission (AE) was introduced to monitor the nanometric machining of a brittle material (silicon) using AFM. In the experiments, AE responses were sampled, as the tip load was linearly increased (ramped load), to investigate machining characteristics during continuous movement. By analyzing the experimental results, it can be concluded that measured AE energy is sensitive to changes in the mechanism of material removal including the ductile-brittle transition during nanometric machining. The critical depth of cut value for the transition is evaluated and discussed.