Papers by Keyword: Nanoscale Cutting

Abstract: Abstract. An orthogonal cutting is a symmetric cutting thus it can be modified as a two dimensional cutting. This paper uses quasi-steady molecular statics method to carry out simulation of two dimensional nanoscale cutting copper work piece by the diamond tools. For the two dimensional quasi-steady molecular statics nanoscale cutting model used by this paper, when the cutting tool moves on a copper work piece, displacement of atoms is caused due to the effects of potential on each other. After a small distance that each atom moves is directly solved by the calculated trajectory of each atom, the concept of force balance is used. The minimum energy method is employed to carry out the search, and obtain the new movement position for each atom. Based on the simulation results, this paper studies the chip formation shape and cutting forces in x direction and y direction.

Abstract: Silicon nitride nanoscale cutting model was established by molecular dynamics simulation, and interactions force between atoms of work-piece was calculated by Tersoff potential function. Through the three-dimensional simulation of silicon nitride nanocutting process, the changes of cutting force, kinetic energy and potential energy in the nanoscale cutting process, and the effects of cutting thickness and cutting speed on the entire cutting process were analyzed. The results showed that the kinetic energy, potential energy and cuting force increased along with the cutting thickness increasing, both kinetic energy and potential energy decreased with cutting speed increasing.

Abstract: Molecular dynamics simulations of the single crystal silicon nanoscale cutting with a diamond tool in ductile mode are carried out to investigate the adhesion phenomenon. After relaxation the silicon atoms on the surface reconstruct to make the potential decrease. The silicon atoms close to the diamond tool have the lowest potential (<-5.5 eV) and form a stable structure with surface atoms on the tool surface.