A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

Authors: D.H. Lee, D.J. Kwon, Yi Koan Hong, Jin Goo Park

A Preliminary Model Accounting for the Suction Pressure in CMP Process

Authors: Chao Hui Zhang, Jian Bin Luo, Qiu Ying Chang

A Study of the Form Error Compensation for Aspherical Lens Machining

Authors: Pei Lum Tso, Ho Chiao Chuang

Calculation on Temperature Rise of CMP Process: Roughness Effects Considered

Authors: Wei Ye, Chao Hui Zhang

Contribution of Porous Pad to Chemical Mechanical Polishing

Authors: Chao Hui Zhang, Jian Bin Luo

Effect of Pad Surface Asperity on Removal Rate in Chemical Mechanical Polishing

Authors: Michio Uneda, Yuki Maeda, Ken Ichi Ishikawa, Kazutaka Shibuya, Yoshio Nakamura, Koichiro Ichikawa, Toshiro K. Doi

Fuel Characteristics Research and Regression Analysis for Blend Fuel of Biomass and Coal

Authors: Zhi Wei Wang, Ting Zhou Lei, Feng Yue, Xiao Feng He, Jin Ling Zhu

Pad Effects on Slurry Flows in CMP System

Authors: Chao Hui Zhang, Jian Qun Zhang

Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing

Authors: Hyoung Jae Kim, Hae Do Jeong, E. Lee, Y. J. Shin

Simulation on Temperature Distribution in Chemical Mechanical Polishing

Authors: Jin Quan Liu, Chao Hui Zhang, Wei Ye