Papers by Keyword: Particle Contamination

Abstract: In this study, the effect of deep cryogenic treatment on the generation of stainless steel particles in screw tightening process in hard disc drive assembly was investigated. During the cryogenic treatment, the specimens of both stainless steel screw and contacting tool (called as “bit”) material were quenched in a chamber containing liquid nitrogen at-196 oC with the soaking times of 33 hr. The specimens were then subjected to sliding wear tests under normal loading conditions. The experiments used for simulating dry sliding wear mechanisms were carried out by TriboGear machine. The machine consists of a stationary bit loaded against the plate containing screw. The screws used were made of martensitic 410 stainless steel and the bit was made of S2 tool steel. The experiments were carried out under both under single and multiple loading cycles under the normal load corresponding to the effective stresses higher and lower than the yield strength of screw material. The results showed that the deep cryogenic treatment led to more homogeneous distribution of fine size carbide particles in both martensitic 410 stainless steel and S2 tool steel. This lead to different failure mechanism of the stainless steel resulting in smaller and slender stainless steel particles generated. This was expected due to the effect of the change in the dimension of carbide, the stress distribution in the material and the crack propagation path.

Abstract: This paper gives an overview about all activities performed within a common project between industrial and academic partners to define clean room concepts for the first worldwide high volume semiconductor front end facility IFD for 300 mm power semiconductors. The investigation within this study is the base for the 300 mm container strategy resulting in new innovative manufacturing and automation concepts.

Abstract: Study on the movement of conducting particle is useful for managing particles in gas insulation systems. The authors observed the movement of conducting prolate spheroidal particles under uniform electric field in air. From the experimental results we found three patterns of the movement. The critical electric field results in particle rotating or lifting. The particles rotated about the contact point before lifting in most cases. The measured particle-rotating field was lower than the analytical ones by 6 and 21% for 9 and 18 mm gaps, respectively. From the experiment, the size of the particles and the gap distance affect the critical field. The voltage polarity has no effect on the critical field for particle movement because of little difference between the experimental values of positive and negative polarities.

Abstract: Exposure of TSVs from the backside in 3D-SIC is a multistep process [1-. Two steps in this process flow (thinning module) are potentially a high risk for particle contamination: wafer edge trimming and wafer thinning by grinding.