Papers by Keyword: RCA

Abstract: Under the concept of sustainable construction it is necessary to establish harmonized indicators, standards and methods for assessing the impact of building products and technological processes of the construction industry on the environment. One of the basic commodity that have a significant impact on the environment is construction waste and his recycling options. Concrete aggregate (RCA), which can be made from concrete elements, has a great potential in reducing the volume of landfills and full re-using of concrete rubble. It can also fulfill sustainability criteria for construction by the re-use of this stony concrete components. The study takes into account local characteristics RCA, but the aim is to globalize outcomes and evaluate them, especially for parameterization used in the design phase of building information modeling.

Abstract: In the article the possibility of utilization of two waste materials: Recycled Concrete Aggregate (RCA) fraction 4-16 mm and Class F fly ash (from coal burning power plant) in high perfor-mance concrete (HPC) was presented. Concrete with RCA were made with varying amount of cement and Suplementary Cementing Materials (SCM). The specimens of concrete were tested to compare mechanical properties as well as some properties related to the durability of concrete. Compression strength values up to 71.40 MPa were achieved and good values of properties determinig durability of reinforced concrete structures.

Abstract: In the article the possibility of utilization of two waste materials: Recycled Concrete Aggregate (RCA) fraction 0-2 mm and Class C fly ash (from lignite burning power plant) in Controlled Low-Strength Material (CLSM) was presented. The research covered twelve different mixtures. The mixtures differed in cement and fly ash content as well as content of the fine aggregate. As a fine aggregate 0-2 mm fraction of RCA or river sand were used. The results showed that use the fine fraction RCA instead of sand does not cause technological problems and allows, depending on the needs, obtaining the material with different properties and a wide range of applications.

Abstract: This paper reports on the contact angle measurement analysis on a silicon based surface for anodic bonding process cleaned by three distinct cleaning processes. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.

Abstract: This paper reports on the contact angle measurement analysis on a glass based surface for anodic bonding process cleaned by three distinct cleaning processes. The three types of glass based surface used were silica, pyrex, and soda lime glass. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. The solid surface is considered hydrophilic when water contact angle is smaller than 90°, and hydrophobic profile if the water contact angle is larger than 90°. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.

Abstract: RCA clean has evolved since 1965 [1]. Typically used before critical thermal steps, depositions/etches, or after strip operations, these solutions are robust and reliable. Stringent semiconductor demands of shrinking feature size, increased contamination sensitivity and cost pressure have led to cleaning projects that improve performance and reduce chemical usage. One of the sources of contamination is the process chemicals themselves, where wafers are exposed to chemicals for etching or cleaning. Concerns over contamination are compounded in wet benches where chemical baths are re-circulated for periods up to 24 hours. Metal impurities can arise from insufficiently pure chemicals or water, tanks, carriers, plumbing components, chemical containers, incoming wafers and handling equipment. Strict chemical, DIW and material specifications as well as dilute chemistry and reduced temperature have benefited the industry as a whole. Trends such as lower temperature/concentration SC1, and higher temperature/concentration SC2 have reached a point of diminishing returns for metal contamination reduction. In the same way, chemical and water purity are well below detection, so improvements are difficult to quantify.[2]