Papers by Keyword: Residual Compressive Stress

Abstract: Magnetic memory signals and hardness of 35CrMo tempered and quenched steel were acquired during tensile testing. The magnetic signals of 35CrMo steel increased monotonously with the increase of tensile stress before yielding, followed by sudden decrease with further increase of stress after yielding. The zero-cross point of H_p(y) varied during tensile testing, indicating varied position of stress concentration zones with the process of tensile testing. Vickers hardness of the stress concentration zones of 35CrMo steel was lower than that around it, which may be attributed to the residual stress. The relationship between zero-cross point of H_p(y) and Vickers hardness was considered.

Abstract: In this Study, a Good Combination between Si₃N₄-Based Seal Coatings and Porous Si₃N₄ Substrate Was Achieved by Room Temperature Spraying and Pressureless Sintering. To Evaluate the Joint Quality, Residual Stress due to Thermal Expansion Mismatch between the Coatings and Porous Layers Were Characterized by Computational Studies Using the Finite Element ANSYS Code. It Was Found that Si₃N₄-Based Seal Coating Allows a Gradual Change in Thermal Expansion Mismatch, Minimizing the Thermal Stresses Arising from Cooling or Heating. Further Theoretical Analysis Indicates that the Thermal Expansion Mismatch between the Two Layers Produced a Large Strengthening Effect for the Fraction of the Porosity below a Critical Level and that Substrates with the High Fraction of Porosity Showed Complete Cracking, as the Cracks Initiating in Adjacent Coatings. And the Volume Fraction of Pores Required to Cause Crack Deflection, in the Porous Layer, Was Predicted. The Effects of Layer Thickness and Porosity Fraction on Residual Stress Were Studied, which Are Used as Predictions towards Better Design of Composite Materials.

Abstract: In order to analyze effect of processing parameters on Laser Shock Peening(LSP), a novel numerical model integrated with FEM and statistical optimization algorithm was established, and the numerical simulation of LSP process was carried out. In simulation, laser pulse energy, beam diameter and center distance were considered as control parameters, while the compressive residual stress and the deformation value as output aim parameters,. The results indicates that the laser pulse energy has the strongest impact on the surface residual stress, while the spot diameter affects the section residual stress and the surface deformation. Moreover, the response surface function was applied to predict and optimize laser parameters. Lastly the presented method was verified by experiments.

Abstract: Aimed to eliminate the harmful residual tensile stress produced on the surface of bearing ring in the conventional bearing processing and join the automatically strengthen and polished technology together, the paper provide a set of new strengthening-polishing bearings equipment, designed to effectively improve the bearing surface’s quality and produce the surface residual stress which can extend the bearing’s fatigue life. The prototype, based on the pre-theoretical design, has been successfully developed, and now is in field testing.

Abstract: Laser shot peening (LSP) has recently received more and more attention as a viable laser processing technology, since it can obtain the desirable residual compressive stress to improve fatigue life of the material by precisely controlling laser parameters. The purpose of this paper is mainly to explore the optimal residual compressive stress in the surface layer during LSP by statistical optimization algorithm. Based on the finite element analysis software ANSYS, Multi-island Genetic Algorithm (MIGA) is adopted to find the best solution of design requirements, the control parameters are laser pulse energy and spot diameter, while the aim parameters are residual compressive stress and deformation values, respectively. The results indicate that the optimal residual compressive stress obtained by integrated optimization technique can significantly improve the mechanical properties of the target after LSP. It provides a guiding importance for parameters optimization in future experimental research and practical application.

Abstract: Comparing with conventional mechanical shot peening (SP) technique, water cavitation peening (WCP) experiments of Almen strips were carried out on a self-manufactured equipment. The results show that WCP demonstrates a wide range of standoff distance (SD) that from the nozzle to the surface of the object. By measuring the colour changes of the Fuji pressure sensing film, over 110 MPa impacting pressure was detected, which is resulted from the bubbles blasting on the sample surface when the SD is from 65 to 100 mm under 40 MPa of operating pressure. 600 MPa compressive residual stress achieved on the suface of the Almen strips after WCPed for 32 min. The depth of the zone affected by the compressive residual stress is about 100 µm. The highest residual stress appears in the top surface layer, while in case of SP it appears in the subsurface. Compared to SP, WCP is capable to get rather smoother surface and cause less deformation of the testing sheet, simultaneously.

Abstract: Microscale laser shock peening (μLSP) is a novel surface treating technology which oriented to microscale metal components in MEMS. Beneficial compressive residual stress is induced at the shocked region to improve the performance of microstructure based on wave-solid interactions. In this paper, the basic principle of μLSP and mechanism of wave-solid coupling were introduced, the influence factors on strengthening effects, such as micro-size effect, anisotropy, dislocation, stacking fault, grain boundary and surface energy were discussed from the microscopic point of view, the results provide theoretical guidance for further study.

Abstract: In situ sulphur doping of cubic boron nitride (cBN) films was investigated by adding H2S into a plasma-enhanced chemical vapor deposition system. It was found that the nucleation of cBN was suppressed severely with a very low H2S concentration, while cBN could be grown continuously even at a H2S concentration as high as that of the boron source after its nucleation. Accordingly, S was incorporated into cBN films meanwhile keeping the cubic phase concentration as high as 95%. And a rectification ratio of approximately 10 5 was observed at room temperature for heterojunction diodes prepared by depositing S-doped cBN films on p-type silicon substrates, which suggests the possibility of an n-type-like doping. Moreover, 1500K post annealing of cBN films in H2 atmosphere was found to be able to release the residual compressive stress evidently. Thus, film adhesion strength increased markedly, and cBN films reached a thickness over 200 nm without peeling off from silicon and quartz substrates in air after 9 months.