Papers by Keyword: Residual Gas

Abstract: In this paper, temperature characteristic of a previous developed nickel-chromium (Ni-Cr) thin film atmosphere pressure sensor is analyzed caused by residual gas. As expected, the output signal of the previous fabricated sensor increases with atmosphere pressures. But when pressure load is fixed, the voltage-temperature characteristic is nonlinear. One factor of this effect is residual gas. Based on the pressure-displacement equation of membrane, the gas balance equation and Provided that the deformation of membrane is spherical crown, the relationship equation of relative change of piezoresistor is defined. Studying the First order derivative and second order derivative of relationship equation of relative change of piezoresistor, it is proved that the residual gas will affect the temperature characteristic of previous designed sensor.

Abstract: The present work reports a method to prevent the condensation defects on contact hole patterns by improving the rinsing process after a dry etching. In general, residual gases on the surface after the dry etching can be easily removed by using a DI water rinse. However, the residual gas can not be completely removed in high aspect ratio contact holes, resulting in the condensation defect. In this work, in order to completely remove the residual gas inside the contact holes, several rinse processes were employed such as a megasonic rinse, a sequential rinse and a hot temperature rinse. These proposed rinse methods were effective in eliminating the residual dry etching gases in the high aspect ratio contact holes and thus were able to remove condensation defects on contact holes.