Authors: Qiu Yun Huang, Lei Guo, Ioan Marinescu
Abstract: Ultraviolet-cured resin bond, abrasive tools have been studied and have proven to have substantial advantages over conventional abrasive tools, not only in low energy cost and high efficiency when manufacturing the tool itself, but also in better performance when machining some materials [1,2]. However, very little research has been done to study the mechanism of UV cured abrasive tools. Nevertheless, many researchers have investigated the performances of such tools compared with some conventional tools. A mechanism of UV cured, resin bond, diamond wheel was proposed as the hybrid of grinding and lapping, which is called as grind/lap (G/L) process [3]. In the paper, the proposed mechanism was verified by comparing the experimental results of three processes. Three wheels were used to simulate grinding, lapping and grind/lapping operation separately under the same experimental setting. The results showed that the RA obtained by G/L wheel decreased to a value between those gained by grinding and lapping operations after 10 minutes and it became the lowest of the three as time increases. The RA and MRR of three processes indicated that at the beginning of operation, the abrasives in G/L wheel are fixed by the cured resin, and as machining time increases, the small grains get released from the wheel and act as loose abrasives. Therefore, the mechanism of the UV cured resin bond diamond wheel is verified as the dominant grinding at the beginning and lapping at the end, which was also illustrated by the surface profile of machined part.
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Authors: Heike Kitzig, Nima Jandaghi, Bahman Azarhoushang, Alireza Vesali
Abstract: In order to decrease the negative environmental impacts of the cutting fluids (for example, disposal of grinding sludge) and also to reduce the manufacturing costs and the required space for the machines the dry grinding can be a conceivable alternative for the conventional grinding processes. Nevertheless, dry grinding has not been widely introduced into industry because of the high temperature generated in the grinding zone and difficulties of heat transfer without coolants. Selection of the proper grinding wheel bonds, grit sizes and concentration has significant effect on the grinding performance and the generated heat in the contact zone. This paper addresses the effects of the grinding wheel bond and the concentration on the dry grinding process efficiency through comparing the results of the carried out experiments with three resin bonded cBN-cup-wheels, each consisting different bond components. For this purpose, surface roughness and thermal damages during dry and wet grinding (utilizing grinding oil) by three different resin bonds were measured. The results show almost identical surface roughness values for dry and wet grinding. Furthermore, using the resin-kryolith-graphite bonded wheel leads to a reduction in thermal damages on the workpiece. Through different experiments, it was shown that the different bonds, used in this study, have significant influence on the chip loading of the grinding wheels. This is contributed to the different chip formation mechanisms and induced grinding temperatures when grinding by the different wheel bonds.
237
Authors: Akihiro Sakaguchi, Tomoyuki Kawashita, Shuji Matsuo
Abstract: Photovoltaic power, a well known renewable energy source, has been introduced on a global basis. A popular variation has many solar battery cells constituted by a polycrystalline or a single crystal silicon wafer. Therefore each cell’s conversion efficiency from solar energy to electrical energy is very essential. Recently, a fixed grain wire method, in which the wafer is sliced by a wire fixing grains on the surface with a bond or an electrodeposition, is employed in that slicing process. Thus, the wire surface topography must be obtained in order to sustain reliable accuracy. In this paper, the measurement method of a diamond wire surface topography using an image processing method is proposed. According to this method, the distribution of grains on the surface can be expressed numerically after grains are extracted from the captured images of the wire surface. Finally, the effectiveness of the proposed scheme was verified through a measurement experiment for a diamond wire.
709
Authors: Qian Fa Deng, Zhi Xiong Zhou, Yu Gang Ren, Bing Hai Lv, Ju Long Yuan
Abstract: Resin bond is one of the most widely bond used for manufacturing abrasive product. This review paper discusses historical perspectives on resin bond, there are different abrasive products which can be produced by using various types of resin bond such as modification of Phonetic resin and a new water-soluble resin. It is intended to help readers to gain a more comprehensive view on resin bond used for abrasive products and to be instrumental for research and development in producing abrasive products.
105
Authors: Shao Hui Yin, M. Wang, Jian Wu Yu, Feng Jun Chen, Yu Wang
Abstract: Based on the magnetic field controlling principle, a new manufacturing method and experimental research of fine grain diamond grinding wheel were introduced. The magnetic particles could form spatial chain structures under magnetic field which can make abrasives distributed uniformly within the mold. Therefore, small surface roughness can be obtained when grinding. The manufacturing and dressing of fine grain diamond grinding wheel based on magnetic field controlling (acronym FGDWMC) were introduced. The comparison grinding tests between the magnetic field controlling and nonmagnetic field controlling of wheels were studied. The grinding experiment result showed that the surface roughness was better after being machined by FGDWMC, and it was improved by about 20nm.
195
Authors: K.H. Li, Q. Guo, M.Y. Liu, Y.J. Zhao, D.L. Shi
Abstract: Back grinding is the key working procedure in the silicon wafer manufacturing process. Ground silicon wafers ought to have low subsurface damage layer thickness (SSD ) and surface roughness value. It requires that the wheel should have high self-sharpening ability and consistent performance. In this paper, the research on pore-forming agent in order to improve the wheel’s self-sharpening ability of the resin-bond diamond grinding was conducted. The research includes the pore-forming mechanism of various pore-forming agent, the influence of pore-forming agent’s type and the effect on the bond’s strength, the influence of pore-forming agent on the grinding performance of the wheel. Moreover, it examines the improved grinding wheel’s grinding effect by grinding tests.
169
Authors: Milton L. Hoff, Stuart C. Salmon
Abstract: Grinding tests and trials on production equipment is a most expensive proposition. The
expense is not only with respect to the monetary cost, but also the down time associated with
interrupting a production line to make special runs and set-ups. That high cost is generally the
reason given why not to conduct production grinding tests. Testing is more easily justified in a
laboratory environment, however the testing can become “clinical” such that it is far removed from
the real world of production grinding and the results are often unrealistic. It has been the object of
this project to target an industry and simulate, as closely as possible, a production grinding
environment, in the laboratory, to encompass all of the realism of bearing production but with
quick-changeover features that allow frequent and accurate adjustments to the process with respect
to the set-up but moreover, the grinding fluid. The end result is test data that is meaningful, directly
relevant, acceptable and understandable to the industry. It has also provided a platform for further
investigative work with respect to the surface texture produced by certain fluid chemistries.
314
Authors: Hiroshi Matsuura, Kazuhiro Hane, Yasuhiro Kunieda, Nobuhito Yoshihara, Ji Wang Yan, Tsunemoto Kuriyagawa
Abstract: The state of the wheel surface after dressing is important for processing of a surface to
the nano-order level. A laser dresser was developed using ultraviolet (UV) laser light, which
imparts no mechanical damage to the resin bond. One feature of this system is that UV laser energy
is transmitted by a special optical fiber for UV light, and is transmitted only to the resin bond. Using
this newly developed laser dresser, it was possible to ablate the resin bond to a depth of over 2
microns using a fiber with a core diameter of 200 microns.
169
Authors: Yan Hui Wang, Yu Cheng Zhao, Ming Zhi Wang, Jian Bing Zang
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