Papers by Keyword: SOP

Abstract: In the present scenario, it is necessary to follow lean manufacturing techniques more effectively and efficiently in order to meet the challenges of the global competitive market. Hence it is inevitable to introduce lean techniques which increase the productivity and reduce the lead time that ultimately results in customer satisfaction. Lean manufacturing has widely been executed in large scale industries over the past three decades. Lean means nothing but the creation of more value for customers with fewer resources and is the current trend for management of products and services. Companies are able to respond to changing customer desires with high variety, high quality, and fast throughput times with low cost. Also information management has become much simpler and more accurate. The main aim of this paper is to study the existing system in a small scale automotive component manufacturing industry and use lean tools to reduce lead time without greatly affecting the current working systems in the industry. Standard Operating Procedure (SOP) is used to standardize the production and Kanban is also introduced by indicating the part number and part description to all work stations. Ranked position weight method in line balancing is used to reduce the transportation time of products from one station to another. Cycle time and setup time were reduced by about 350 seconds and 1500 seconds by work standardization and hence the productivity also increased. After implementing SOP the overall lead time reduced from 5780 seconds to 3946 seconds.

Abstract: The intelligent anti-disoperation operation order system is developed. The system is established on operation management system (OMS). OMS provides the underlying technology support for operation order system. The supports of OMS include basic resources such as graphics, device, topology, the integration of real-time data sources, and the interfaces with external systems and so on. The full process management of operation order as well as operation security checking function based on automation system are realized. The system is composed of the relevant servers of OMS, communication server of local dispatch center, dispatcher workstations and other workstations, user workstations of substation, etc. The system is graphics, intelligent application system for dispatcher and supervisor. It is mainly used to many functions such as intelligent operation order generating, multilayered security checking of operating instructions, operation order management in accordance with procedure, offline operation order generating, operation training, etc.

Abstract: For long distance oil and gas pipeline system has the characteristics of high accident rate tending to happen in personnel job activity, this paper expounds the necessity and application steps of HAZOP (Hazard and Operability Analysis) analysis for long-distance pipeline system key operation procedure (SOP). The HAZAOP analysis of deviation, causes of deviation, consequences, existing control measures and recommending measures, make the key operating procedure safer, and also contributes to the improvement of the oil and gas pipeline system safety and fitness between operating procedures and hardware facilities. The results of application examples show that HAZOP is able to identify key operating procedure loopholes, helps enterprises optimize key operating procedures, improves the hardware facilities, and has an important role to improve the security of the key operation of oil and gas pipelines.

Abstract: For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder joints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.