Papers by Keyword: Semibonded Abrasive Grinding Plate

Abstract: This work aims to obtain fine surface of silicon wafer during precision and ultra precision machining, and presents a new method called semibonded abrasive machining. A semibonded abrasive grinding plate is used in the semibonded abrasive machining. Abrasive particle of 1000# Green SiC and bond named SSB are adopted in the manufacture of the plate. Four plates with different concentration of bond which are 1.5%, 2.5%, 3.5%, 4.5% respectively are made. The paper studies the effect of concentration of bond, the control parameters which include the lapping time, the load, and the rotating velocity of the plate on the surface roughness. Experimental results indicate each plate with different concentration of bond can obtain fine surface roughness. When the load or the rotating velocity increases, there is little effect on the surface roughness, but the material removal rate increases correspondingly. The initial roughness of the silicon wafer surface lapping by the plate could be improved from Ra 0.2μm to Ra 0.02μm in 9 min.

Abstract: The semibonded abrasive machining technique is expected to get high surface integrity and processing efficiency attributed to the „trap‟ effect which can reduce or even eliminate the surface damage induced by the larger particles. The goal of the work is to validate the „trap‟ effect by the experiments of semibonded and loose abrasive machining under the conditions of adding and not adding the larger particles. Free surface damage monocrystal silicon wafers after polishing are adopted as workpieces, and 1000# SiC as abrasive particles while 180# SiC as the larger particles. The cast iron plate is used as grinding plate in the loose abrasive machining and different bond concentration semibonded abrasive grinding plate SSB-1 and SSB-2 are used as grinding plates in semibonded abrasive machining. The roughness Rv and SEM photos of workpieces surface are tested to evaluate the extent of „trap‟ effect. The result shows that the semibonded abrasive grinding plate has the „trap‟ effect. The shore hardness value of the semibonded abrasive grinding plate can be used to be one parameter to evaluate the degree of the ‟trap‟ effect of the semibonded abrasive grinding plate.

Abstract: The amorphous Ni-Pd-P alloy films with superior property have good heat conductivity and wear performance. They are widely used in the protecting coating. Copper has been chosen to be a substrate material of the produce of amorphous Ni-Pd-P alloy films with its unique electrical properties. The precision lapping technology for the copper substrate using semi-bonded abrasive grinding plate is studied in this paper. The influences of the different lapping parameters on the surface roughness, material removal rate on copper substrate surface formation in the precision lapping process are both discussed. Experimental results indicate that the copper substrate can be efficiently processed by 800# SiC semi-bonded abrasive grinding plate of, and the initial roughness of a machined surface could be improved from 0.553μm Ra to 0.28μm in 10min, yielding a ideal rarely scratch surface.