Papers by Keyword: Si Crystal

Abstract: Silicon carbide devices limitations often originate from the quality of the substrate material. Therefore it is interesting to investigate devices fabricated on alternative source materials. Currently, CREE is the world market leader of SiC wafers. Nowadays, some new companies begin to propose alternative material. The European manufacturer SiCrystal furnishes now some epiwafers for the fabrication of 1,2kV devices. In this paper we present 4H-SiC 1.2 kV pin diodes with a JTE termination realized on a SiCrystal epiwafer. The devices exhibit a blocking voltage of 1.2 kV, a current density of 420 A.cm-2 and a specific differential series resistance of 4.4 m-⋅cm2. The yield of fabricated diodes with a breakdown voltage greater 600 V is superior to 75%.

Abstract: 95% Al2O3 ceramics and Si <100> crystal were implanted by Ti ion in a MEVVA implanter. The influence of implantation parameters was studied by varying ion fluence. The samples were implanted by 80 keV Ti ion with fluences from 1 x1015 to 1 x 1018 ions/cm2, respectively. The samples were investigated by SEM, SAM, and four-probe measurement. Differentmorphologies were observed on the surfaces of the samples due to irradiation damage, and clearly related to implantation parameters. XRD spectra confirm formation of titanium silicides on the surfaces of Si samples with ion fluences equal to or high than 1x1015 ions/cm2. The experimental results suggest that it is possible to synthesise titanium silicides by using a MEVVA implanter.