HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by keyword: «Single Crystal Silicon»

• Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon
  Published in: Application of Diamond and Related Materials (p72)
• Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation
  Published in: Advances in Abrasive Technology XI (p469)
• Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools
  Published in: Advances in Abrasive Technology XI (p144)
• Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding
  Published in: Advances in Abrasive Technology IX (p433)
• Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon
  Published in: Machining and Advanced Manufacturing Technology X (p265)
• Experimental Research on the Influence of Indenter Tip Radius to Indentation Hardness
  Published in: e-Engineering & Digital Enterprise Technology (p327)
• Fracture Toughness Measurement of a Micro-Sized Single Crystal Silicon
  Published in: Advances in Fracture and Strength (p292)
• Friction and Wear of Polished Single Crystal Silicon at Different Area
  Published in: Advanced Design and Manufacturing Technology I (p117)
• From Atomic-Level Lattice Structure to Estimate the Silicon Mechanical Bulk Behaviour Using the Atomistic-Continuum Mechanics
  Published in: Advances in Composite Materials and Structures (p281)
• Influence of Extended Structural Defects on the Characteristics of Electroluminescence in Efficient Silicon Light-Emitting Diodes
  Published in: Gettering and Defect Engineering in Semiconductor Technology X (p283)
• Investigation of an Atomic Force Microscope Diamond Tip Wear in Micro/Nano-Machining
  Published in: Advances in Abrasive Processes (p315)
• Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing
  Published in: Advances in Grinding and Abrasive Technology XV (p306)
• Potential Analysis in Nanoturning of Single Crystal Silicon Using Molecular Dynamics
  Published in: Advanced Materials (p3236)
• Processing Grinding-Damaged Silicon Wafers by High-Frequency Nano-Second Laser Irradiation
  Published in: Advances in Abrasive Technology XII (p451)
• Reaction of Iron with Amorphous Silicon and Crystal Silicon for the Fabrication of Iron Silicides
  Published in: Defects and Diffusion in Semiconductors X (p99)