Papers by Keyword: Smooth Surface

Abstract: Based on the CFD-FSI fluid-solid coupled method, the equivalent elastohydrodynamic lubrication model of the micro-texturing dimple surface on the condition of the medium velocity and medium load, low velocity and heavy load, high velocity and heavy load, low velocity and light load and high velocity and light load is respectively solved by numerical method in this paper. And obtain the oil film pressure distribution curve and the oil the film thickness distribution curve on the conditions of steady state, and analyze the influence of micro-texturing dimples on the bearing capacity of the equivalent elastohydrodynamic lubrication model. Analysis results show that: compared with the corresponding minimum film thickness on the conditions of smooth surface, the minimum film thickness of micro-texturing dimple surface on the conditions of the medium velocity and medium load, low velocity and light load is increased, which indicates the bearing capacity of the equivalent elastohydrodynamic lubrication model of the micro-texturing dimple surface is increased; while the minimum film thickness of the rest conditions is decreased, which shows that the bearing capacity of the equivalent elastohydrodynamic lubrication model of the micro-texturing dimple surface is decreased. The study in this paper lays the foundation for the design and optimization of the micro-texturing dimple.

Abstract: A new planarization polishing method, based on the cluster magnetorheological (MR) effect and using MR fluid to form the flexible polishing pad, is presented in this paper to polish optical glass. To explore the machining characteristic of the viscid and flexible polishing pad based on the cluster MR-effect, some process experiments were conducted to reveal the influence of the machining gap, the speed of the polishing disc and the polishing time on the machining effect. The results indicate that the viscid and flexible polishing pad based on the cluster MR-effect under a strong magnetic field can reduce surface roughness effectively. When the strength of the magnetic field is 2000Gs, and the content of the carbonyl iron is 12%, the surface roughness can be reduced rapidly from the original Ra0.27μm to Ra1.4nm based on the cluster MR-effect.

Abstract: Improvements in the quality and consistency of 4H-SiC epitaxy wafers are now starting to enable growth of commercial SiC power device applications in areas such as inverters for photo-voltaic systems and power supplies. Recent work has achieved very low epitaxy surface roughness and very low BPD (Basal plane dislocation) in the on 4 degree off-axis substrates. In this paper, we report characterization of the very low BPD epitaxy wafers and a newly observed triangular defect.