Papers by Keyword: Tersoff

Abstract: SiC ceramics is very promising to be widely applied due to the excellent physical and chemical properties.However, the very difficult process of SiC ceramics hinders its application. In this paper, the nano-cutting of SiC ceramics is simulated based on molecular dynamics. The influences of the tool rake and cutting depth on the cutting force, the kinetic energy and potential are analyzed. The results show that the cutting force, system kinetic energy and potential energy increase firstly,reach the maximum, and then decrease in the process; with the increase of the tool rake, the cutting force and the kinetic energy decrease; with the increase of the cutting depth, the cutting force increases, and the kinetic energy and the potential energy decreases. These results are very helpful to understanding the process mechanism of SiC ceramics and increasing its process efficiency

Abstract: Molecular dynamics is a rapidly developing field of science and has become an established tool for studying the dynamic behavior of material machining. A three-dimensional molecular dynamics (MD) model about the atoms of the diamond cutting tools and the diamond grits is built by using the molecular dynamics. The Tersoff potential function is used to calculate the force and potential energy among the atoms of the diamond tools and the atoms of the diamond grits. The lapping processes at a special cutting depth are simulated. The variety of the specimen potential energy in the lapping process is observed. The mechanism of the diamond micro machining and the form of the surface formation are given by comparing the distribution maps of atoms in initial and cutting states. This study will give a strong support to the diamond cutting tools’ lapping.