Papers by Keyword: TiAlN Film

Abstract: Two series of TiAlN and Ti₃AlN films have been deposited on Si (100) substrates by reactive magnetron sputtering TiAl and Ti₃Al targets in Ar/N₂ mixture. The effects of incoming ions energies controlled by V_b on the microstructure, morphologies, residual stress and hardness have been explored by XRD, SEM, AFM, surface profiler and nanoindentation. The results showed that single phase cubic Ti-Al-N solid solubility formed by Al atoms replacing some Ti atoms in the cubic TiN lattice occured in both TiAlN and Ti₃AlN films. As substrate bias increased, the preferred orientation firstly changed from (111) to (200), and then returned to (111) at higher substrate bias. At the same time, high substrate bias promoted the densification of films and presence of high compressive stress, which is benefit for improvement of hardness.

Abstract: TiAlN films were prepared by closed field Unbalanced Magnetron Sputtering ion plating. EDS, XRD and SEM were used to test the films’ chemical composition, microstructure and surface morphology. In addition, the films’ surface microhardness, bonding strength and friction coefficient were also determined. The experimental results indicate that the TiAlN films of different substrate hardness have dense film structure and the same chemical composition, the hard substrate microhardness of the film can reach 2575 HV0.025 and soft substrate can be up to 2295 HV0.025, the bonding strength of which is respectively 59N and 56N, Friction coefficient is 0.45 and 0.5.

Abstract: In this paper,TiAlN films were deposited on the surface of tool steel substrates using multi-arc ion plating technology at the assistance of hollow cathode（HC）electron beam. The influence of hollow cathode electron beam on the phase composition、microstructure and the performance of TiAlN films were studied.The phase composition，microstructure，surface profile and adhesive strength of the films to the substrate were investigated by X-ray diffraction（XRD）,scanning electron microscopy(SEM),Profilemeter and UNMT-1 Multi-specimen Test System respectively.The results show that with the increase of the current of the hollow cathode, the preferred orientation of（200）was weakened，and the surface of TiAlN films become smooth and the macroparticals decreased obviously.The hollow cathode electron bean can remarkably improve the adhesive property of TiAlN films，and the scratching test show that the critical load from 38N increase to 61N.

Abstract: By means of reaction magnetron sputtering, TiAlN ternary compound films were deposited on AZ91D magnesium alloy substrates. The influence of partial pressure ratio of N₂ to Ar (N₂/Ar) on the microstructure and properties of TiAlN film was explored with scanning electron microscopy (SEM), X-ray diffraction (XRD), and tests of microhardness, hydrophile and corrosion resistance. The results show that with the increase of N₂/Ar partial pressure ratio from 0.5:10 to 1.5:10, Ti₂N becomes the main film phase and the size of the crystals cluster decreases. As the N₂/Ar ratio is as higher as 2:10, the film crystals change from Ti₂N to TiN with coarse clusters. With increase of N₂/Ar rate, the hardness, hydrophobic nature and corrosion resistance of the TiAlN film tend to increase.

Abstract: The fatigue strength of TiAl intermetallic alloy coated with TiAlN film was studied in vacuum at 1073K using a SEM-servo testing machine. In addition, three kinds of TiAlN films were given by physical vapor deposition (1, 3, and 10μ m). The fatigue strength of 3μ m was highest. Also, the fatigue strength of 1μ m was lowest. From this result, existence of optimum film thickness was suggested because the difference of fatigue strength arose in each film thickness. The justification for existence of optimum film thickness is competition of 45-degree crack and 90-degree crack. The 45-degree crack is phenomenon seen in the thin film (1μ m), and is caused by plastic deformation of TiAl substrate. The 45-degree crack is the factor of the fatigue strength fall by the side of thin film. In contrast, the 90-degree crack is phenomenon in the thick film (10μ m), and is caused as result of reaction against load to film. The 90-degree crack is the factor of the fatigue strength fall by the side of thick film. In conclusion, the optimum film thickness can perform meso fracture control, and improves fatigue strength.