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Articles by keyword: «Titanium Nitride TiN»

• A DFT Study of Au Deposition on (001) Surface of TiN
  Published in: Nitrides and Oxynitrides 2 (p177)
• Advanced Ceramic-Ceramic Composite Tool Materials for Metal Cutting Applications
  Published in: Advanced Ceramic Tools for Machining Application - II (p173)
• Application of Energy Dispersive X-Ray Diffraction for the Efficient Investigation of Internal Stresses in Thin Films
  Published in: APPLIED CRYSTALLOGRAPHY XX (p39)
• Application of Pseudo-Superplasticity to Produce TiN/Ti₅Si₃ and TiC/Ti₅Si₃ Nano Grain Composites for Micro Molding
  Published in: Superplasticity in Advanced Materials - ICSAM 2003 (p311)
• Application of Synchrotron Radiation for Structural Analysis of Mesoscopic Structures Produced by Ball Milling
  Published in: Synthesis and Properties of Mechanically Alloyed and Nanocrystalline Materials (p517)
• Behavior of Oxide Film in Transient-Liquid-Phase Bonding of Tin with Filler of Bismuth Film
  Published in: THERMEC 2006 (p3503)
• CBN Composites with a Nanosized Binding Phase
  Published in: From Nanopowders to Functional Materials (p149)
• Characterization of (Ti, Al) N Films Synthesized by Arc Ion Plating
  Published in: Advanced Materials and Processing (p641)
• Characterization of Mechanical Properties of Brittle Coating Systems by Various Indentation Techniques
  Published in: Innovation in Ceramic Science and Engineering (p53)
• Characterization of Mechanosynthetized Sulphides
  Published in: Synthesis and Properties of Mechanically Alloyed and Nanocrystalline Materials (p217)
• Chemistry of Hybrid Organic-Inorganic Materials Synthesized via Sol-Gel
  Published in: Soft Chemistry Routes to New Materials (p313)
• Cooling Induced Non-Equilibrium Segregation of Impurity Concentration of Phosphorus and Tin to Grain Boundaries in an Iron-3% Nickel Alloy
  Published in: Intergranular and Interphase Boundaries in Materials (p201)
• Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys
  Published in: Creep and Fracture of Engineering Materials and Structures (p655)
• Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD Technology
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p457)
• Development of New Processing Technology which Realizes in-situ Dispersion of Nano-Particles and Whiskers in Ceramic Matrix
  Published in: The Science of Engineering Ceramics II (p481)