Papers by Keyword: Two Dimensional Ultrasonic Vibration

Abstract: As the reliable technology, ultrasonic assisted machining is widely used for brittle materials. This paper provides a two-dimensional(2D) ultrasonic vibration assisted machining technology with tool vibration using elliptical vibrator with longitudinal mode and bending mode, and set up the experiment device. Si wafer is taken as the workpiece, and single point cutting experiments for micro groove are investigated. For the further application, the ultrasonic assisted polishing experiment with wheel block is executed. Experimental results indicate that ultrasonic assisted cutting with tool vibration can improve the cutting performance and enhance the ductile removal. And the ultrasonic assisted polishing with whetstone piece makes the better surface roughness and higher material removal rate.

Abstract: As a new fixed-abrasive machining method, chemo-mechanical grinding (CMG) is developed from chemical mechanical polishing (CMP), with the obvious advantage of geometric accuracy determinacy and no slurry. To improve material removal rate and enhance the popularity of CMG, this paper introduces a combined grinding method, i.e., two dimensional ultrasonic vibration assisted CMG (2D-UACMG). Si wafer is taken as the workpiece and the influence of ultrasonic vibration modes and process parameters on the surface roughness and the material removal is examined. The results show 2D-UACMG can obtain better surface quality with little surface damage at nanometer level compared with the conventional CMG without the ultrasonic vibration.

Abstract: In this paper, the mathematical model with two associated coordinates is established for two-dimension ultrasonic vibration group system by impedance analysis, and natural frequency equation of 2D vibration system is deduced by which the influence of natural frequency change of individual components on the natural frequency of group system is analyzed. Amplitude-frequency characteristics of system were tested which verified the correctness of the theory. In simulation experiment on large plate under two-dimensional ultrasonic vibration grinding, superimposed tracks of a number of irregular ovals exist in vibrating plane, that is different from previous research that only one simply oval track exists in the vibrating plane apparently. The results supply a reliable theoretical and experimental basis for the further discussions on the abrasive removal mechanism under two-dimensional ultrasonic vibration.

Abstract: This paper worked on two dimensional ultrasonic grinding system with workpiece adhered to ultrasonic vibration. It analyzed the working locus of abrasive particle under two dimensional ultrasonic grinding (TDUG), and emulated the working course, and gave the key parameters affecting grinding efficiency and grinding locus’s characteristic under different grinding parameters, and brought forward the cutting course between abrasive particle and workpiece under TDUG belongs to an new rotating dynamic contact cutting model. At the same time, it put forward the theoretically critical speed condition under TDUG to obtain the optimum grinding effect, and verified good micro-feature of finished surface under TDUG by the means of grinding tests of nano ZrO2 ceramics.