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Articles by keyword: «Ultra-Precision Grinding»

• 3D Fractal Analysis of Ultra Precision Grinding Influencing on the Surface Topography of Brittle Material
  Published in: Advances in Grinding and Abrasive Technology XIV (p523)
• A Deterministic Method to Predict Geometrical Interference between Grinding Wheel and Workpiece for Ultra-Precision Aspherical Grinding
  Published in: Surface Finishing Technology and Surface Engineering II (p325)
• A Study of the Electrolytic Conditioning of Resin-Metal Bond Fine Grit Diamond Wheels
  Published in: Advances in Grinding and Abrasive Processes (p1)
• Control of Nano-Topography on an Axisymmetric Ground Surface
  Published in: Advances in Abrasive Technology XI (p96)
• Development of Ultra-Precision Grinding Process for Aspheric Surface Based on Feed Rate Controlling and Error Compensation Methods
  Published in: Manufacturing Science and Engineering I (p2192)
• Experimental Study on Intelligent Monitoring of Diamond Grinding Wheel Wear
  Published in: Manufacturing Automation Technology (p714)
• Factors Influencing the Surface Quality during Ultra-Precision Grinding of Brittle Materials in Ductile Mode
  Published in: Advances in Abrasive Technology VI (p201)
• Geometric Models of the Ultra-Precision Grinding for Large Non-Axisymmetric Optical Aspheric Surfaces
  Published in: Advances in Abrasive Technology VI (p57)
• Improvement in the Ground Surface Roughness of Fused Silica X-Ray Mirror with ELID-Grinding
  Published in: Advances in Abrasive Technology V (p143)
• Investigation on the Dressing Shape of Vacuum Chuck in Wafer Rotation Grinding
  Published in: Advances in Abrasive Technology VIII (p171)
• Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids
  Published in: Advances in Precision Engineering (p183)
• Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
  Published in: Advances in Abrasive Technology XI (p459)
• Modeling on the Ground Wafer Shape in Wafer Rotational Grinding
  Published in: Advanced Mechanical Engineering (p694)
• Optimising the Process Conditions in Ultra-Precision Grinding to Achieve Surface Finish of Optical Quality
  Published in: Advances in Grinding and Abrasive Technology XIII (p8)
• Processing Grinding-Damaged Silicon Wafers by High-Frequency Nano-Second Laser Irradiation
  Published in: Advances in Abrasive Technology XII (p451)