Papers by Keyword: (0001)

Abstract: This paper presents and analyse the experimental results of 4H-SiC(0001) lateral MOSFETs and MOS capacitors with gate oxides grown directly in N₂O environment or in O₂ ambient followed by a N₂O post oxidation annealing process. Different nitridation temperatures of 1200°C, 1300°C, 1400°C and 1500°C have been investigated. Results have demonstrated that at high temperature (>1200°C) there is a significant improvement in the interface trap density (~1.5×10¹¹ cm^-2eV^-1 at 0.2 eV) and field effect channel mobility (19 cm²/V.s) of 4H-SiC MOSFET compare with those at lower temperature (1×10¹² cm^-2eV^-1 at 0.2 eV and 4 cm²/V.s). Among those nitridation temperatures, 1300°C has found to be the most effective in increasing the field effect channel mobility and reducing threshold voltage.

Abstract: Ab initio calculations were carried out to study the origin of the trap at the SiO2/SiC (MOS: Metal-Oxide-Semiconductor) interface with the three different faces of the substrate, (0001), (000-1), and (11-20). In a previous report we experimentally discovered that the (11-20) face is suitable for high channel mobility. The calculation in this report showed that the MOS interface achieved the intermediate states due to distortion and thus acted like an interface trap. The interface trap density of the MOS interface on the (11-20) face substrate was smaller than those on the other faces. The interface trap densities were 2.14, 3.36, and 1.40 in units of 1015 cm-2 for the above listed substrate orientations, respectively. For clarity, the channel mobility was compared experimentally to reveal that it realized a larger value for the (11-20) substrate than the other two faces. From our results, we concluded that (11-20) face substrate was more suitable for high power device applications than the (0001) face or (000-1) face substrates.

Abstract: In this work, the electrical characteristics and the reliability of 80nm thick deposited oxides annealed in NO and N2O on the 4H-SiC Si-face for gate oxide application in MOS devices is analyzed by C-V, I-V measurements and by constant current stress. Compared to thermally grown oxides, the deposited oxides annealed in N2O or NO showed improved electrical properties. Dit-values lower than 1011cm-2eV-1 have been achieved for the NO sample. The intrinsic QBD-values of deposited and annealed oxides are one order of magnitudes higher than the highest values reported for thermally grown oxides. Also MOSFETS were fabricated with a channel mobility of 20.05 cm2/Vs for the NO annealed deposited oxide. Furthermore annealing in NO is preferred to annealing in N2O regarding µFE- and QBD-values.

Abstract: Thermal oxidation process of silicon carbide in ultra-thin oxide regime has been studied by performing in-situ and real time spectroscopic ellipsometry. We found the thermal oxidation at 700°C forms no or extremely thin interface layers between SiC and oxide layers. In contrast, the oxidation at 850°C forms an interface layer of around 1 nm in thickness, having similar thickness and optical constants of the interface layers formed by the oxidation at higher temperature than 1000°C. To make clear the conditions no interface layer is formed, i.e., whether low temperature growth or thin oxide thickness is crucial, we have performed the oxidation at 850°C in the reduced oxygen pressure. Based on the results of these experiments, we discussed the origin of the formation of interface layers as well as the oxidation mechanism of SiC.

Abstract: Real time observations of SiC (000–1) C-face and (0001) Si-face oxidation were performed using an in-situ ellipsometer over the oxygen-partial-pressure range from 0.1 to 1.0 atm. We analyzed the relations between oxide growth rate and oxide thickness by applying an empirical relation proposed by Massoud et al. We found the occurrence of oxidation enhancement in the thin oxide regime also for Si-face as well as for C-face. We have discussed the oxygen-partial-pressure dependence of the oxidation rate constants between SiC C- and Si face, comparing with that of Si.