The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon

Kazuhito Ohashi; Y. Sumimoto; Y. Fujita; Hiroyuki Hasegawa; Shinya Tsukamoto

doi:10.4028/www.scientific.net/KEM.389-390.356

Paper Titles

A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV
p.332

Actively Cooled and Activated Coolant for Grinding Brittle Materials
p.338

Spatial Distribution of Cooling Mist for Precision Grinding
p.344

A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces
p.350

The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon
p.356

Virtual Truing and Dressing of Grinding Wheel
p.362

Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding
p.368

A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet
p.375

Hole Machining of Glass by Micro Abrasive Suspension Jets
p.381

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390The Possibility of Dressless Restoration of...

The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon

Abstract:

The grinding performance of wheel remarkably decreases by the loading of wheel surface in dry grinding of hard carbon parts. In this report, we propose the removal method of loaded carbon chips in which an adhesive tape is removed with carbon chips after putting on a loaded wheel surface by an elastic roller with the setting load . The removal characteristics are experimentally investigated by analyzing the projecting height of abrasive grains, removal force of adhesive tape and so on. The removal method results in the enough projecting height of abrasive grain.

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Periodical:

Key Engineering Materials (Volumes 389-390)

Pages:

356-361

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.389-390.356

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Online since:

September 2008

Authors:

Kazuhito Ohashi, Y. Sumimoto, Y. Fujita, Hiroyuki Hasegawa, Shinya Tsukamoto

Keywords:

Abrasive Grain, Adhesive Tape, Carbon Chips, Dry Grinding, Grinding Wheel, Loading

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References

[1] Y. MIYAGI, T. SUZUKI, K. YAMAMOTO: Development of a Peel Adhesion Tester of Wide Range of Test Conditions and a Proposal of Analyzing Method of the Test Vol. 23 (1987) No. 3, pp.81-88.

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[2] K. FUKUZAWA: Development of Technologies with Tacky Adhesion Products (CMC Publishing Co., Ltd., Tokyo 2003), p.24.

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[3] S. KAWAMURA, A. YANO, M. HIGUCHI, T. SUGITA: Grinding and Abrasive machining (KYORITSU SHUPPAN CO., LTD., TOKYO 1999), p.119 Fig . 11. Effect of the pressing load on the peeling force Fig . 12. Effect of the peeling speed on the peeling force.

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